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Starting without known chemistry

Connection is not holding

Identify the fracture pattern and systematically narrow down the cause.

Product and application

Select the system so that only relevant test steps appear. If no system is specified, the test will remain general.

All test steps in this guide can be used even without the guided process.

Terms briefly explained
Hand strength
The parts should be handled carefully. The connection is not yet fully load-bearing.
Complete curing
The curing conditions and times prescribed for the product were adhered to.
Adhesive gap
Distance between the two joining surfaces, not the length of the adhesive seam.
Pot life and nozzle life
Test the processability of a mixed quantity and the processability in the mixing nozzle separately.
Adhesive detaches from a surface: 3 test steps

A largely clean surface suggests an adhesion problem. With aluminum and zinc, a thin oxide layer may also have detached.

1 · Surface

Are the actual materials clean, dry, and properly prepared?

Oil, release agents, varnishes, and weak oxide layers can impair adhesion. Changing suppliers can also alter the surface.

  • Determine the material and alloy or plastic mixture. Ask the supplier about any changes to release agents, plasticizers, and coatings.
  • Adjust the cleaning process to the material and allow the cleaning agent to evaporate completely. Check the blasting media for cleanliness and condition.
  • Apply adhesive promptly after pretreatment and avoid further contact or oxidation. If necessary, test wettability using suitable testing methods.
2 · Order & Fixing

Is sufficient adhesive applied to the correct area and is the joint held still during the curing process?

Gaps in the order, incorrect contact points, and movements during curing can explain local failures.

  • Check the dosage and actual wetting of the contact surface.
  • Maintain fixation until the required strength is achieved; pay attention to air gaps and torn structures.
  • Document the error rate and distribution. Individual failures may indicate fluctuating process conditions.
3 · Load

Is the bond only subjected to stress within its operating conditions after sufficient curing?

Premature stress, peeling forces, media, or differing thermal expansion can weaken a connection that initially appears to be good.

  • Compare the waiting time before loading with the product data sheet.
  • Capture joint geometry, temperature, chemicals and humidity in real-world use.
  • For peeling loads or different materials, test tougher or more flexible systems with the application engineer.
Adhesive tears inwards: 3 test steps

Adhesive will remain on both sides. First check the curing, then test under load.

1 · Mixture

Do the components, mixing ratio and mixing nozzle match the product data sheet?

Uneven application or unsuitable nozzles will leave unmixed areas. A general mixing ratio does not apply to all products.

  • Check the correct resin/hardener combination and prescribed ratio.
  • Check the cartridge piston, the discharge of both components, and the recommended mixing nozzle; pre-run the nozzle according to the manufacturer's instructions.
  • For dosing systems, check the actual quantities of both components. Document any streaks or unmixed areas.
2 · Temperature

Does the actual processing temperature correspond to the specifications for the product?

Cold temperatures slow down many curing reactions. A thin layer of adhesive may cure more slowly than a larger, mixed quantity.

  • Measure the temperature of the material, component, and workplace.
  • Adhere to the specified waiting and curing times. Use heat only within the product-specific curing plan.
  • Consider pot life and time in the mixing nozzle separately from the time until load-bearing capacity.
3 · Load

Is the bond only subjected to stress within its operating conditions after sufficient curing?

Premature stress, peeling forces, media, or differing thermal expansion can weaken a connection that initially appears to be good.

  • Compare the waiting time before loading with the product data sheet.
  • Capture joint geometry, temperature, chemicals and humidity in real-world use.
  • For peeling loads or different materials, test tougher or more flexible systems with the application engineer.
The component breaks or delaminates. 3 test steps

The failure lies in the material or its surface layer. A stronger adhesive will not automatically solve the problem.

1 · Surface

Are the actual materials clean, dry, and properly prepared?

Oil, release agents, varnishes, and weak oxide layers can impair adhesion. Changing suppliers can also alter the surface.

  • Determine the material and alloy or plastic mixture. Ask the supplier about any changes to release agents, plasticizers, and coatings.
  • Adjust the cleaning process to the material and allow the cleaning agent to evaporate completely. Check the blasting media for cleanliness and condition.
  • Apply adhesive promptly after pretreatment and avoid further contact or oxidation. If necessary, test wettability using suitable testing methods.
2 · Load

Is the bond only subjected to stress within its operating conditions after sufficient curing?

Premature stress, peeling forces, media, or differing thermal expansion can weaken a connection that initially appears to be good.

  • Compare the waiting time before loading with the product data sheet.
  • Capture joint geometry, temperature, chemicals and humidity in real-world use.
  • For peeling loads or different materials, test tougher or more flexible systems with the application engineer.
3 · Order & Fixing

Is sufficient adhesive applied to the correct area and is the joint held still during the curing process?

Gaps in the order, incorrect contact points, and movements during curing can explain local failures.

  • Check the dosage and actual wetting of the contact surface.
  • Maintain fixation until the required strength is achieved; pay attention to air gaps and torn structures.
  • Document the error rate and distribution. Individual failures may indicate fluctuating process conditions.
Failure only after some time; 3 test steps

Moisture, media, temperature changes or migrating plasticizers can weaken a bond subsequently.

1 · Load

Is the bond only subjected to stress within its operating conditions after sufficient curing?

Premature stress, peeling forces, media, or differing thermal expansion can weaken a connection that initially appears to be good.

  • Compare the waiting time before loading with the product data sheet.
  • Capture joint geometry, temperature, chemicals and humidity in real-world use.
  • For peeling loads or different materials, test tougher or more flexible systems with the application engineer.
2 · Surface

Are the actual materials clean, dry, and properly prepared?

Oil, release agents, varnishes, and weak oxide layers can impair adhesion. Changing suppliers can also alter the surface.

  • Determine the material and alloy or plastic mixture. Ask the supplier about any changes to release agents, plasticizers, and coatings.
  • Adjust the cleaning process to the material and allow the cleaning agent to evaporate completely. Check the blasting media for cleanliness and condition.
  • Apply adhesive promptly after pretreatment and avoid further contact or oxidation. If necessary, test wettability using suitable testing methods.
3 · Storage

Has the material been stored within its shelf life and according to the data sheet?

Aging, humidity, separation of components or unsuitable temperatures can alter processing and hardening.

  • Record batch number, expiry date and inventory history.
  • Check for segregation, thickening, and contamination. Do not correct conspicuous material with unauthorized additives.
  • If the material quality is unclear, check a fresh, correctly stored batch for comparison.
Mixed or unclear fracture pattern: 3 test steps

Document both sides of the connection before determining a cause.

1. Document the fracture pattern

Are both fracture surfaces and the original structure documented?

Several types of failure can occur simultaneously.

  • Create an overview and detailed photos of both sides. Note the materials, batch, and process conditions.
  • In case of unclear findings, include the application technique along with the documented observations.
2 · Surface

Are the actual materials clean, dry, and properly prepared?

Oil, release agents, varnishes, and weak oxide layers can impair adhesion. Changing suppliers can also alter the surface.

  • Determine the material and alloy or plastic mixture. Ask the supplier about any changes to release agents, plasticizers, and coatings.
  • Adjust the cleaning process to the material and allow the cleaning agent to evaporate completely. Check the blasting media for cleanliness and condition.
  • Apply adhesive promptly after pretreatment and avoid further contact or oxidation. If necessary, test wettability using suitable testing methods.
3 · Load

Is the bond only subjected to stress within its operating conditions after sufficient curing?

Premature stress, peeling forces, media, or differing thermal expansion can weaken a connection that initially appears to be good.

  • Compare the waiting time before loading with the product data sheet.
  • Capture joint geometry, temperature, chemicals and humidity in real-world use.
  • For peeling loads or different materials, test tougher or more flexible systems with the application engineer.
Additional information from the source
  • Save fragments or informative photos. Document both sides of the connection.
  • Have product, batch, materials, joint dimensions and failure rate available for application engineering.
  • Provide references to previous, successful adhesives or process versions for comparison. If necessary, provide material samples for laboratory testing.

German version prepared according to the archived Permabond guideline adhesive-failure-diagnosis.md. Always compare product-specific values ​​and procedures with the corresponding technical data sheet.