Skip to content

Technical Sprays

Maintenance, assembly, disconnection.

All technical sprays
Search for application

Construction chemicals

Sealing, bonding, flooring.

All construction chemicals
Search for application

MS polymers & hybrid adhesives

Merbenit HM21

Universal 1K-SMP sealant adhesive with long open time (30 min), Shore A 45 and 350% elongation at break — EMICODE EC1Plus + Eurofins IAC Gold certified

Curing technology
Moisture curing
Density
1.52 g/cm³
Hardness (Shore A)
45
Chemical group
Silane-modified polymer

CHF 0.00 / pc.
  • Tensile Strength
  • Density
  • Hardness (Shore A)
  • Chemical group
  • Color
  • Temperature range (°C)
  • Processing temperature
  • Cured layer thickness after 24 hours
  • Stress at 100% elongation
  • Volume change
  • Container
  • Consistency
  • Elongation at break
  • Number of components
  • Curing technology
Your selection Merbenit HM21
General terms and conditions of business

HS Code: 3214.1000

Merbenit HM21 Sample Offer

Technical Data

Typical values, not a specification. The technical data sheet (TDS) is binding.

Product Information

Tensile Strength
approx. 2.5 N/mm²
Temperature range (°C)
-40 °C to +90 °C
Container
290ml cartridge, 600ml bag
Consistency
Non-slumping, ≤ 3 mm

Performance at Full Cure

Elongation at break
approx. 350%

Physical Properties

Density
1.52 g/cm³
Hardness (Shore A)
45
Chemical group
Silane-modified polymer
Color
black, white, grey
Cured layer thickness after 24 hours
≥ 3.0 mm
Curing technology
Moisture curing

Features

Processing temperature
+5 °C to +40 °C
Stress at 100% elongation
approx. 1.6 N/mm²
Volume change
≤ 5%
Number of components
1K
Keywords
  • MS Polymer
  • Universal
  • Automatic dispensing
  • General industry and manufacturing
  • Construction
  • Metal
  • Plastic
  • Low odor
  • Solvent-free
  • Silicone-Free
  • Isocyanate-free
  • Vehicle construction
  • Elastic
  • Merbenit
  • Spray gun accessories
  • Sealant
  • Mechanical engineering

Product Description

Merbenit HM21 is a universal 1K-SMP sealant adhesive with long open time (30 min), Shore A 45, and 350% elongation at break — certified to EMICODE EC1Plus + Eurofins IAC Gold.

Silyl-modified polymers (SMP) are modern high-performance adhesives — moisture-curing, solvent-free, isocyanate-free, and silicone-free, with a very broad adhesion spectrum on metals, painted and galvanized surfaces, engineering plastics, glass, ceramics, concrete, stone, and wood. Paint-compatible, corrosion-protective, shock- and vibration-resistant, low-odor. HM21 is a specific variant of the Merbenit SMP series — the most important properties and applications are listed below.

Long pot life + EMICODE EC1Plus

Merbenit HM21 is the universal choice of the Merbenit series — 30 minutes of open time allow careful application even on large adhesive seams, with high final strength (Shore A 45) and 350% elongation at break. EMICODE EC1Plus and Eurofins IAC Gold confirm very low-emission processing — suitable for indoor applications.

HM21 in figures
Shore A 45
Hardness
30 min
Pot life
350 %
Elongation at break
EMICODE EC1Plus
low emission

What sets HM21 apart

Long open time (30 min)
Careful processing of even large adhesive seams without haste.
EMICODE EC1Plus + Eurofins IAC Gold
Very low emission — certified for indoor applications.
Very broad adhesion spectrum
Metals, painted and galvanized surfaces, plastics, glass, ceramics, concrete, stone, wood.
High elongation at break (350%)
Withstands strong movements — tolerance-compensating.
Paint-compatible, sandable and paintable
Can be overpainted with lacquers after curing.
Free of solvents, isocyanates, silicones, and phthalates
Safe in processing and at the workplace.

What is HM21 used for?

Metal construction
Flexible adhesive and sealing joints in metal construction.
Apparatus and mechanical engineering
Universal bonding with long pot life.
Plastics technology
Bonding of engineering plastics to metals.
Ventilation and air conditioning technology
Sealing and bonding in HVAC systems.
Body, wagon, vehicle, and container construction
Tolerance-compensating joints with weather resistance.
Interior applications
EMICODE EC1Plus permits use in living and working spaces.
Data Sheets & Safety Data Sheet
TDS and SDS in multiple languages — view or download directly.
To the documents →

Processing

1
Clean substrate
Bonding surfaces must be clean, grease-free, and dry — degrease with cleaning alcohol, isopropanol, or acetone. Bonding to PP, PE, PTFE, and silicone is not possible; bituminous substrates are also unsuitable.
2
Primer (if required)
On smooth substrates use Primer V40, on absorbent substrates Primer V21. On powder-coated surfaces and plastics, Primer V40 is recommended.
3
Open cartridge / pouch
Cut the cartridge nozzle to the desired bead cross-section and insert into a standard cartridge gun (290 / 310 / 400 / 600 ml).
4
Application
Apply as a uniform bead or spot bonding. Join within the open time — press the components together with sufficient pressure.
5
Smoothing + correcting
Within the working time (5–30 min depending on variant), smooth with a smoothing tool or correct the position.
6
Curing
Curing through air humidity — through-cure 2–3 mm in 24 h, fully crosslinked after 48 h. Higher air humidity accelerates crosslinking.

Recommended accessories


HM21 in comparison with related Merbenit products

Direct comparison of mechanical and processing values — all data from the official Merbenit TDS.

HM21
Current Product
HT50 →SF50 →HS60 →
Crosslinking system1K moisture-curing1K moisture-curing1K moisture-curing1K moisture-curing
ConsistencyNon-sagging, ≤3 mmnon-sagnon-sagnon-sag
Shore A hardnessA 45A 45A 50A 60
Tensile Strength2.5 N/mm²2.5 N/mm²3.4 N/mm²3.3 N/mm²
Elongation at break350 %200 %200 %250 %
Modulus 100%1.6 N/mm²1.5 N/mm²2.2 N/mm²2.3 N/mm²
Processing time30 min10 min8 min10 min
Through-curing 24 h≥3.0 mm2.5 mm≥3.5 mm≥2.0 mm
Through-cure 48 h≥4.0 mm4.0 mm≥4.5 mm≥3.0 mm
Density1.521.481.401.54
Temperature range–40 / +90 °C–40 / +90 °C–40 / +90 °C–40 / +90 °C
Volume change≤5 %≤4 %≤7 %≤8 %
Main applicationMetal constructionImmediate-bonding applicationsMinergie-ECO construction projectsFood industry

Frequently asked questions about HM21

Practical application and design questions — answered by SILITECH.

Merbenit HM21: Universal 1K-SMP sealant adhesive with long open time (30 min), Shore A 45 and 350% elongation at break — EMICODE EC1Plus + Eurofins IAC Gold certified. Main applications: metal construction, apparatus and mechanical engineering, plastics technology.

SMP = Silane-modified polymer. This modern adhesive class combines the advantages of silicone (elasticity, weather resistance, broad adhesion spectrum) and polyurethane (mechanical strength, paint compatibility) — without their disadvantages (silicone: not paintable, corrosion on some metals; PU: isocyanates, often problematic indoors). SMP adhesives are solvent-free, isocyanate-free, and silicone-free, paint-compatible, corrosion-protective, and adhere without primer to most substrates — except PE, PP, PTFE, and silicones.

HM21 adheres to metals (aluminum, stainless steel, steel), powder-coated and painted surfaces, galvanized/anodized/chromated/zinc-coated substrates, many plastics, ceramics, stone, concrete, render, wood, and glass. Not suitable for: PP, PE, PTFE (Teflon), silicones, and bituminous substrates. For critical material combinations, we recommend a preliminary test or the use of a primer (V40 for smooth, V21 for absorbent substrates).

Store in unopened original container in a dry, cool place — typically between +5 and +30 °C. Consult the safety data sheet (SDS) before use. Observe the expiry date on the packaging. Process opened cartridges promptly — skin formation in the nozzle will block further application.

In the comparison table above, you will find related Merbenit products with different properties — different hardness, pot life, elongation at break, or special certifications (IMO, EN 45545-2, FMVSS 212, ISEGA, Minergie-ECO). If you are unsure about the optimal choice, we will be happy to advise you — contact SILITECH with your specific application (substrate pairing, desired hardness, processing workflow, certification requirement).