PERMABOND 4ES70
Permabond 4ES70 — Epoxy structural adhesive.
1K heat-curing epoxy adhesive specifically for needle mounting in medical devices — fast curing at low temperatures, high shear and peel strength
Documents
Internal reference:
49-4ES70.FL.K001
Permabond 4ES70 is a 1K heat-curing epoxy adhesive specifically for needle mounting in medical devices — fast curing at low temperatures, high shear and peel strength.
Permabond one-component epoxy adhesives — thermosetting, solvent-free, with high shear and peel strength, ideal for needle mounting, sensors, and structural bonding. 4ES70 is tailored to specific applications — the most important properties and areas of use are listed below.
Permabond 4ES70 is optimized for needle mounting in medical devices — a 1K heat-curing epoxy adhesive that cures quickly at low temperatures. It offers high shear and peel strength, and high temperature resistance after curing.
What makes 4ES70 stand out
What is the 4ES70 used for?
Processing
Recommended accessories
4ES70 in comparison
Direct comparison with related Permabond products from our range.
4ES70 Current Product |
Double/Bubble E01 → | MT382 → | MT3821 → | |
|---|---|---|---|---|
| Chemical Base | 1K epoxy | 2K Epoxy | 2K modified epoxy | 2K modified epoxy (flexible) |
| Viscosity | see TDS | pasteus | self-leveling | thixotropic |
| Grade | Medical Device | Industrial | Industrial | Industrial |
| Color | see TDS | see TDS | see TDS | black |
| Set Time | heat-activated | a few minutes | min. | min. |
| Full Cure | heat-dependent | 24 h RT | 24 h RT | 24 h RT |
| Main application | Needle assembly Medical | Mobile repair | Engineering plastics + potting | Flexible adhesive, black |
Technical data for PERMABOND 4ES70
| Product Information | |
|---|---|
| Brand | Permabond |
| Container | 1 kg |
Please refer to the technical data sheet (TDS) in the "Documents" tab for binding values.
Documents and data sheets
Click on a document for the preview or the download icon for direct download.
Technical Data Sheets (TDS) 2
Frequently asked questions about 4ES70
Practical application and design questions — answered by SILITECH.
Permabond 4ES70: A one-component, heat-curing epoxy adhesive specifically designed for needle mounting in medical devices — fast curing at low temperatures, high shear and peel strength. Main applications: needle mounting, medical device structural bonding, sensor bonding.
One-component epoxies are pre-activated and crosslink under heat—no mixing, no pot life stress. Advantages: simple application, long storage of the ready-to-use mixture (refrigerated). Disadvantages: heat curing is required, energy consumption for curing. Preferred for high-throughput production with a defined heat-cure schedule (e.g., medical device needle assembly).
Store in the unopened original container in a dry, cool place — Permabond adhesives typically between +5 and +25 °C, exact values see TDS. Consult the Safety Data Sheet (SDS) before use. Observe the expiry date on the packaging. Store cyanoacrylates cool (ideally refrigerated) for maximum shelf life.
In the comparison table above, you will find related Permabond products with different properties — viscosity, mixing ratio, special certification. If you are unsure about the optimal choice, we will be happy to advise you — contact SILITECH with your specific application (substrate pairing, load, curing condition).
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Product Specifications
| Brand | Permabond |
| Container | 1 kg |
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Documents and data sheets
Safety Data Sheets (SDS) and Technical Data Sheets (TDS) for download: