PERMABOND ES5720
Internal reference:
49-5720.KT.ML320
HS code:
3506.9190000
Permabond ES558 is a 1K epoxy adhesive for heat curing — industrial application with heat-cure infrastructure.
1K standard epoxy for industrial heat-cure bonding.
1K epoxy resin adhesive for heat curing — standard industrial variant without pot life limitation.
What distinguishes Permabond ES558
What is Permabond ES558 used for?
Processing
Recommended accessories
Important Notes
Which Permabond 1K epoxy for which application?
Permabond ES558 in direct comparison with related products of the ES series.
Permabond ES558 Current Product | Permabond ES550 → | Permabond ES578 → | Permabond ES562 → | |
|---|---|---|---|---|
| Application | Standard 1K epoxy — heat curing | Comparable | Flame-retardant | Standard EN variant |
| Chemistry | One-component epoxy resin (heat-cure) | 1K epoxy | 1K epoxy | 1K epoxy |
| Curing | Heat curing | Heat-cure | Heat-cure | Heat-cure |
Technical specifications for PERMABOND ES5720
| Product Information | |
|---|---|
| Manufacturer | Permabond Engineering Adhesives Ltd |
| Brand | Permabond |
| Container | 320 ml |
| Physical Properties | |
|---|---|
| Chemical group | Epoxy resin |
Please refer to the technical data sheet (TDS) in the "Documents" tab for binding values.
No public documents available.
On request, we will gladly send you TDS and SDS by email, Submit request.
Frequently asked questions about Permabond ES558
Practical application and design questions — answered by SILITECH.
One-component (1K) epoxy adhesive for heat curing — industrial application with no pot life. One-component epoxies are processed directly without mixing and cured in a single heat-cure step.
1K epoxies are processed directly from the container without mixing — no pot life limitation, no mixing errors. Disadvantage: heat curing required (industrial oven, IR lamp, or hot air). 2K epoxies cure at room temperature but require precise mixing and have a limited pot life. 1K is suitable for line production with heat-cure infrastructure, 2K for workshops without an oven.
Heat curing. For exact conditions, refer to the Permabond TDS — typically 30 minutes at 150 °C or equivalent heat input (e.g., 60 min @ 120 °C).
1K heat-cure epoxies bond metals (steel, aluminum, copper), composites (CFK, GFK), ceramics, and selected plastics (with heat resistance). Substrates must tolerate the curing temperature (typically 150 °C).
Permabond ES558 does not have specific industry approvals such as UL94-V0 (see ES578 for the flame-retardant version). For general industrial applications, the product is approved according to Permabond standards.
At 5 to 25 °C. 1K heat-cure epoxies have limited storage stability — reactivity decreases with higher storage temperature. For long shelf life, store refrigerated. Allow adhesive to warm to room temperature before opening.
From the Permabond 1K epoxy range: Permabond ES558 (standard 1K epoxy — heat cure); Permabond ES550 (standard 1K); Permabond ES578 (UL94-V0); Permabond ES562 (single-part heat cure). For UL94-V0 fire protection, see ES578; for high temperature, see ES566/ES569; for IR/hot air curing (without an industrial oven), see ES5691.
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Product Specifications
| Product Information | |
|---|---|
| Manufacturer | Permabond Engineering Adhesives Ltd |
| Brand | Permabond |
| Container | 320 ml |
| Physical Properties | |
|---|---|
| Chemical group | Epoxy resin |
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