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PERMABOND ES566

PERMABOND ES566

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Permabond ES566 — Epoxy structural adhesive, Shore D >70.

High-temperature resistant 1K epoxy — for hot machine components.

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  • Country of origin
  • Chemical group
  • Viscosity (adhesives)
  • Viscosity 2rpm
  • Viscosity 20rpm
  • Specific gravity
  • Operating temperature (°C)
  • Hardness (Shore D)
  • Storage temperature (°C)
  • Maximum gap width (mm)
  • 90°C
  • 100°C
  • 120°C
  • 150°C
  • Curing speed (induction)
  • coefficient of thermal expansion
  • UFI (Unique Formula Identifier)

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Metal composites High adhesive strength PERMABOND

 
General Terms and Conditions.

Shipping usually within 1 to 3 business days
(availability will be confirmed after ordering)

. Express logistics. Fast and reliable within Switzerland & Europe.

Shipping from Swiss warehouse within 24 hours. Batch certificate. Invoice within 30 days (B2B). Technical support.
Shipping & Delivery

Usually 1 to 3 working days

Availability will be confirmed after order receipt.

Express logistics within Switzerland & Europe.

General Terms and Conditions →

Product data

Internal reference: 49-566.KT.G320

HS code: 3506.9190000

Internal reference: 49-566.KT.G320
HS code: 3506.9190000

PERMABOND ES566
PERMABOND ES566
Permabond · Permabond Engineering Adhesives Ltd · SKU 49-566.KT.G320

Permabond ES566 is a high-temperature resistant 1K epoxy heat-cure adhesive with extended temperature reserve for demanding industrial applications.

High-temperature 1K epoxy for applications with continuous temperatures where standard adhesives would lose strength.

APPLICATION PROFILE

High-temperature resistant 1K epoxy — designed for applications with elevated continuous temperatures, retains strength significantly longer than standard 1K epoxies.

Permabond ES566 in figures
High temperature
Resistant
1K
Single-part
Heat Cure
Heat curing
industry
Premium

What distinguishes Permabond ES566

High temperature resistant
Extended temperature reserve.
1K system
Do not mix.
Heat Cure
Heat curing.
No potting season
Can be processed directly.
Solvent-free
100% reactive.
Industry Premium
Demanding applications.

What is Permabond ES566 used for?

Hot machine components
Motors, pumps, industrial furnaces.
Components subject to continuous thermal load
When standard epoxides lose strength.
Industrial soldering process
Suitable for wave soldering and reflow soldering.
High-temperature industrial bonding
Premium applications.
Control cabinet components in hot environments
With heat stress.

processing

1
Clean surfaces
Prepare bonding surfaces to be clean, dry, and free of grease — degrease with Permabond Cleaner A. Lightly sand aluminum and copper to remove oxide layers.
2
Apply adhesive directly
Apply Permabond ES566 directly from the container without mixing — as a 1K system, there is no pot life limitation. Avoid air bubbles.
3
Add and fix components
Assemble the components with sufficient pressure. Use a clamping device or vise to prevent the parts from moving during curing.
4
Perform heat curing
Curing is achieved through heat application — heat curing. Typical conditions: 30 minutes at 150 °C in an industrial oven or equivalent IR/hot air curing. See TDS for exact values.
5
Final strength after cooling
After heat curing, allow the component to cool down – final strength is reached immediately after cooling. Unlike with 2-component epoxies at room temperature, there is no 24-hour waiting time.
Data sheets & safety data sheet
Full TDS and SDS in DE, EN, FR — view or download directly.
To the documents →

Recommended accessories

Permabond Cleaner A Aerosol
Spray cleaner for the quick preparation of bonding surfaces before applying the 1K heat-cure epoxy.
View product →
Permabond ES578 — UL94-V0
Flame-retardant 1K epoxy to Underwriter's Laboratory standard — for safety-critical industrial applications.
View product →
Permabond ES566 — High temperature
High-temperature resistant 1K epoxy for demanding heat applications.
View product →
Permabond ES5691 — IR/hot air
1K epoxy with IR lamp or hot air curing — flexible without an industrial oven.
View product →

Important instructions

Important instructions
Heat curing is required.
storage
Store between 5 and 25 °C. 1K heat-cure epoxides have limited storage stability—reactivity decreases with increasing storage temperature. Observe the expiration date.

Which Permabond 1K epoxy is suitable for which application?

Permabond ES566 in direct comparison with related products of the ES series.

Permabond ES566
Current product		Permabond ES569 →Permabond ES578 →Permabond ES550 →
ApplicationHigh-temperature 1K epoxy — Heat-cure with temperature reserveComparableWith UL94-V0Standard without high temperature
ChemistryOne-component epoxy resin (heat-cure, high-temperature)1K epoxy1K epoxy1K epoxy
CuringHeat curingHeat CureHeat CureHeat Cure
Topics & Application Areas
Key terms related to this product. Also useful for our search and filters.
Metal composites High adhesive strength PERMABOND

Technical data for PERMABOND ES566

All 21 product information 5 Curing speed (oven) 4 Physical properties 6 Curing values ​​1 Mechanical properties 1 Thermal properties 3 General 1
Product information
Manufacturer Permabond Engineering Adhesives Ltd
brand Permabond
Container 320 ml
Country of origin Italy
UFI (Unique Formula Identifier) 0UM0-0UWM-G00Q-FTSU
Curing speed (oven)
90°C 75 minutes
100°C 40 minutes
120°C 25 minutes
150°C 10 minutes
Physical properties
Color gray
Chemical group epoxy resin
Viscosity (adhesives) High viscosity >5000 mPas
Viscosity 2rpm 150000-300000
Viscosity 20rpm 60000-120000
Specific gravity 1.3
Curing values
Maximum gap width (mm) 2
Mechanical properties
Hardness (Shore D) >70
Thermal properties
Operating temperature (°C) -40 to +180
Storage temperature (°C) 2-7
coefficient of thermal expansion 45 x 10⁻⁶ mm/mm/°C
Generally
Curing speed (induction) <3 minutes

For binding values, please refer to the technical data sheet (TDS) in the "Documents" tab.

Documents and datasheets

Click on a document for a preview or the download icon for a direct download.

Technical Data Sheets (TDS) 6
Permabond ES566 - Technical Data Sheet DE.pdf
534 KB
Permabond ES566 - Technical Data Sheet DE.pdf
373 KB
Permabond ES566 - Technical Data Sheet EN.pdf
371 KB
Permabond ES566 - Technical Data Sheet EN.pdf
520 KB
Permabond ES566 - Fiche Technique FR.pdf
346 KB
Permabond ES566 - Fiche Technique FR.pdf
480 KB
Safety Data Sheets (SDS) 3
Permabond ES566 - Safety Data Sheet DE.pdf
402 KB
Permabond ES566 - Safety Data Sheet EN.pdf
397 KB
Permabond ES566 - Fiche de Sécurité FR.pdf
401 KB

Frequently asked questions about Permabond ES566

Practical application and design questions — answered by SILITECH.

High-temperature resistant 1K epoxy — heat curing with extended temperature reserve. 1K epoxies are processed directly without mixing and cured in a single heat-cure step.

One-component (1K) epoxies are processed directly from the container without mixing—no pot life limitations, no mixing errors. Disadvantage: Heat curing is required (industrial oven, IR lamp, or hot air). Two-component (2K) epoxies cure at room temperature but require precise mixing and have a limited pot life. One-component (1K) epoxies are suitable for line production with heat-curing infrastructure, while two-component (2K) epoxies are suitable for workshops without an oven.

Heat curing. For exact conditions, see Permabond-TDS — typically 30 minutes at 150 °C or equivalent heat input (e.g. 60 min @ 120 °C).

One-component heat-cure epoxies bond metals (steel, aluminum, copper), composites (CFRP, GFRP), ceramics, and selected heat-resistant plastics. Substrates must tolerate the curing temperature (typically 150 °C).

Permabond ES566 does not have specific industry approvals such as UL94-V0 (see ES578 for the flame-retardant variant). For general industrial applications, the product is approved according to Permabond standards.

Store between 5 and 25 °C. 1K heat-cure epoxies have limited storage stability—reactivity decreases with increasing storage temperature. For long shelf life, store refrigerated. Allow the adhesive to warm to room temperature before opening.

From the Permabond 1K epoxy series: Permabond ES566 (high-temperature 1K epoxy — heat-cure with temperature reserve); Permabond ES569 (high-temperature 1K); Permabond ES578 (UL94-V0 high-temperature); Permabond ES550 (standard 1K). For UL94-V0 fire protection, see ES578; for high temperature, see ES566/ES569; for IR/hot air curing (without an industrial oven), see ES5691.

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Product specifications

Product information
Manufacturer Permabond Engineering Adhesives Ltd
brand Permabond
Container 320 ml
Country of origin Italy
UFI (Unique Formula Identifier) 0UM0-0UWM-G00Q-FTSU
Curing speed (oven)
90°C 75 minutes
100°C 40 minutes
120°C 25 minutes
150°C 10 minutes
Physical properties
Color gray
Chemical group epoxy resin
Viscosity (adhesives) High viscosity >5000 mPas
Viscosity 2rpm 150000-300000
Viscosity 20rpm 60000-120000
Specific gravity 1.3
Curing values
Maximum gap width (mm) 2
Mechanical properties
Hardness (Shore D) >70
Thermal properties
Operating temperature (°C) -40 to +180
Storage temperature (°C) 2-7
coefficient of thermal expansion 45 x 10⁻⁶ mm/mm/°C
Uncategorized
Curing speed (induction) <3 minutes
Keywords
Keywords
Metal composites High adhesive strength PERMABOND

Documents and datasheets

Safety Data Sheets (SDS) and Technical Data Sheets (TDS) are available for download: