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PERMABOND ES569

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Permabond ES569 — Epoxy structural adhesive, viscosity 250000-500000 mPa·s, Shore D 80-85.

High-temperature resistant 1K epoxy — industrial premium with heat stress resistance.

Price on request

  • Manufacturer
  • Brand
  • Container
  • Color
  • Country of origin
  • Chemical group
  • Viscosity (adhesives)
  • Viscosity mPa.s
  • Operating temperature (°C)
  • Hardness (Shore D)
  • Storage Temperature (°C)
  • Maximum gap fill (mm)
  • Thermal conductivity
  • 130° C
  • 150°C
  • 170°C
  • Cure speed (induction)
  • Steel
  • Aluminum
  • Zinc
  • FRP glass/epoxy
  • CFRP
  • Peel resistance (ISO 4578)
  • Specific Gravity
  • UFI (Unique Formula Identifier)
  • TG Value

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Metal ceramic ferrites

 
General Terms and Conditions

Shipping usually within 1 to 3 business days
(Availability confirmed after order)

Express logistics. Fast and reliable within Switzerland & Europe

From Swiss stock Dispatch within 24h Batch certificate Invoice 30 days (B2B) Technical advice
Shipping & Delivery

Usually 1 to 3 business days

Availability is confirmed after order receipt.

Express logistics within Switzerland & Europe.

Terms and Conditions →

Product data

Internal reference: 49-569.KT.ML320

HS Code: 3506.9190000

Internal reference: 49-569.KT.ML320
HS code: 3506.9190000

PERMABOND ES569
PERMABOND ES569
Permabond · Permabond Engineering Adhesives Ltd · SKU 49-569.KT.ML320

Permabond ES569 is a high-temperature resistant 1K epoxy — an industry-standard heat-cure for demanding heat applications.

High-temperature 1K epoxy for industrial bonding applications under heat stress.

APPLICATION PROFILE

High-temperature resistant 1K epoxy — industrial application with heat curing and extended temperature reserve.

Permabond ES569 in figures
High temperature
Resistant
1K
Single-part
Heat-cure
Heat curing
Industry
Premium

What distinguishes Permabond ES569

High temperature resistance
Extended Reserve.
1K System
No mixing.
Heat-cure
Heat curing.
Industry Premium
High-temperature applications.
Solvent-free
100% reactive.
Multi-Substrate
Various substrates.

What is Permabond ES569 used for?

High-temperature industrial bonding
Machines, pumps, motors.
Components subject to continuous thermal load
Industrial furnaces, heating equipment.
Composite bonding high temp
CFRP/GFRP with heat.
Multi-material
Various substrates.
Premium industrial bonding
Demanding applications.

Processing

1
Clean surfaces
Prepare bonding surfaces clean, dry, and free of grease — degrease with Permabond Cleaner A. Lightly sand aluminum and copper to remove the oxide layer.
2
Apply adhesive directly
Apply Permabond ES569 directly from the container without mixing — as a 1K system, there is no pot life limitation. Avoid air bubbles.
3
Join and fix components
Join components with sufficient pressure. Use a clamping device or clamp to prevent the parts from moving during curing.
4
Perform heat curing
Curing occurs through heat application — heat curing. Typical conditions: 30 minutes at 150 °C in an industrial oven or with equivalent IR/hot air curing. See TDS for exact values.
5
Final strength after cooling
After heat curing, allow the component to cool down — full strength is achieved immediately after cooling. Unlike 2K epoxies at room temperature, there is no 24-hour waiting period.
Data Sheets & Safety Data Sheet
Complete TDS and SDS in DE, EN, FR — view or download directly.
To the documents →

Recommended accessories

Permabond Cleaner A Aerosol
Spray cleaner for quick preparation of bonding surfaces before applying the 1K heat-cure epoxy.
To the product →
Permabond ES578 — UL94-V0
Flame-retardant 1K epoxy per Underwriter's Laboratory standard — for safety-critical industrial applications.
To the product →
Permabond ES566 — High Temperature
High-temperature resistant 1K epoxy for demanding thermal applications.
To the product →
Permabond ES5691 — IR/Hot Air
1K epoxy with IR lamp or hot air curing — flexible without an industrial oven.
To the product →

Important Notes

Important Notes
Heat curing required.
Storage
Store at 5 to 25 °C. 1K heat-cure epoxies have limited storage stability — reactivity decreases with higher storage temperature. Observe the expiration date.

Which Permabond 1K epoxy for which application?

Permabond ES569 in direct comparison with related products of the ES series.

Permabond ES569
Current Product		Permabond ES566 →Permabond ES578 →Permabond ES5691 →
ApplicationHigh-temperature 1K epoxy — Heat-cureComparableWith UL94-V0Variant with IR curing
ChemistryOne-component epoxy resin (heat-cure, high-temperature)1K epoxy1K epoxy1K epoxy
CuringHeat curingHeat-cureHeat-cureHeat-cure
Topics & Application Fields
Key terms related to this product. Also useful for our search and filters.
Metal ceramic ferrites

Technical data for PERMABOND ES569

All 26 product information 5 Curing speed (oven) 3 Performance at final strength 1 Properties of the final bond 1 Physical properties 5 Curing values ​​1 Mechanical properties 1 Shear strength ISO 4587 in N/mm² 5 Thermal properties 2 General 2
Product Information
Manufacturer Permabond Engineering Adhesives Ltd
Brand Permabond
Container 320 ml
Country of origin Italy
UFI (Unique Formula Identifier) UH60-D0X3-1000-XWFU
Cure speed (oven)
130° C 75 minutes
150°C 60 minutes
170°C 40 minutes
Performance at Full Cure
Thermal conductivity 0.5 W/(mK)
Properties of the permanent bond
Peel resistance (ISO 4578) 100-120 N/25mm
Physical Properties
Color black
Chemical group Epoxy resin
Viscosity (adhesives) High viscosity >5000 mPas
Viscosity mPa.s 250000-500000
Specific Gravity 1.2
Curing values
Maximum gap fill (mm) 5
Mechanical properties
Hardness (Shore D) 80-85
Shear strength ISO 4587 in N/mm²
Steel 27-41
Aluminum 17-31
Zinc 14-27
FRP glass/epoxy 9-11
CFRP 10-12
Thermal Properties
Operating temperature (°C) -40 to +180
Storage Temperature (°C) 2-7
General
Cure speed (induction) <3 minutes
TG Value 130°C

Please refer to the technical data sheet (TDS) in the "Documents" tab for binding values.

Documents and data sheets

Click on a document for the preview or the download icon for direct download.

Technical Data Sheets (TDS) 6
Permabond ES569 - Technical Data Sheet DE.pdf
384 KB
Permabond ES569 - Technical Data Sheet DE.pdf
384 KB
Permabond ES569 - Technical Data Sheet EN.pdf
524 KB
Permabond ES569 - Technical Data Sheet EN.pdf
374 KB
Permabond ES569 - Fiche Technique FR.pdf
348 KB
Permabond ES569 - Fiche Technique FR.pdf
348 KB
Safety Data Sheets (SDS) 3
Permabond ES569 - Safety Data Sheet DE.pdf
402 KB
Permabond ES569 - Safety Data Sheet EN.pdf
380 KB
Permabond ES569 - Fiche de Sécurité FR.pdf
401 KB

Frequently asked questions about Permabond ES569

Practical application and design questions — answered by SILITECH.

High-temperature resistant 1K epoxy — industrial application with heat curing. 1K epoxies are processed directly without mixing and cured in a single heat-cure step.

1K epoxies are processed directly from the container without mixing — no pot life limitation, no mixing errors. Disadvantage: heat curing required (industrial oven, IR lamp, or hot air). 2K epoxies cure at room temperature but require precise mixing and have a limited pot life. 1K is suitable for line production with heat-cure infrastructure, 2K for workshops without an oven.

Heat curing. For exact conditions, refer to the Permabond TDS — typically 30 minutes at 150 °C or equivalent heat input (e.g., 60 min @ 120 °C).

1K heat-cure epoxies bond metals (steel, aluminum, copper), composites (CFK, GFK), ceramics, and selected plastics (with heat resistance). Substrates must tolerate the curing temperature (typically 150 °C).

Permabond ES569 does not have specific industry approvals such as UL94-V0 (see ES578 for the flame-retardant variant). For general industrial applications, the product is approved according to Permabond standards.

At 5 to 25 °C. 1K heat-cure epoxies have limited storage stability — reactivity decreases with higher storage temperature. For long shelf life, store refrigerated. Allow adhesive to warm to room temperature before opening.

From the Permabond 1K epoxy series: Permabond ES569 (high-temperature 1K epoxy — heat-cure); Permabond ES566 (high-temperature 1K); Permabond ES578 (UL94-V0); Permabond ES5691 (1K variant). For UL94-V0 fire protection, see ES578; for high temperature, see ES566/ES569; for IR/hot air curing (without an industrial oven), see ES5691.

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Product Specifications

Product Information
Manufacturer Permabond Engineering Adhesives Ltd
Brand Permabond
Container 320 ml
Country of origin Italy
UFI (Unique Formula Identifier) UH60-D0X3-1000-XWFU
Cure speed (oven)
130° C 75 minutes
150°C 60 minutes
170°C 40 minutes
Performance at Full Cure
Thermal conductivity 0.5 W/(mK)
Properties of the permanent bond
Peel resistance (ISO 4578) 100-120 N/25mm
Physical Properties
Color black
Chemical group Epoxy resin
Viscosity (adhesives) High viscosity >5000 mPas
Viscosity mPa.s 250000-500000
Specific Gravity 1.2
Curing values
Maximum gap fill (mm) 5
Mechanical properties
Hardness (Shore D) 80-85
Shear strength ISO 4587 in N/mm²
Steel 27-41
Aluminum 17-31
Zinc 14-27
FRP glass/epoxy 9-11
CFRP 10-12
Thermal Properties
Operating temperature (°C) -40 to +180
Storage Temperature (°C) 2-7
Uncategorized
Cure speed (induction) <3 minutes
TG Value 130°C
Keywords
Keywords
Metal ceramic ferrites

Documents and data sheets

Safety Data Sheets (SDS) and Technical Data Sheets (TDS) for download: