Silicones, silicone oils, sprays
Casting and potting resins
Technical Data
Typical values, not a specification. The technical data sheet (TDS) is binding.
Product Information
- Manufacturer
- Permabond Engineering Adhesives Ltd
- Brand
- Permabond
- Container
- 320 ml
- Country of origin
- Italy
- UFI (Unique Formula Identifier)
- UH60-D0X3-1000-XWFU
Cure speed (oven)
- 130° C
- 75 minutes
- 150°C
- 60 minutes
- 170°C
- 40 minutes
Performance at Full Cure
- Thermal conductivity
- 0.5 W/(mK)
Properties of the permanent bond
- Peel resistance (ISO 4578)
- 100-120 N/25mm
Physical Properties
- Color
- black
- Chemical group
- Epoxy resin
- Viscosity (adhesives)
- High viscosity >5000 mPas
- Viscosity mPa.s
- 250000-500000
- Specific Gravity
- 1.2
Curing values
- Maximum gap fill (mm)
- 5
Mechanical properties
- Hardness (Shore D)
- 80-85
Shear strength ISO 4587 in N/mm²
- Steel
- 27-41
- Aluminum
- 17-31
- Zinc
- 14-27
- FRP glass/epoxy
- 9-11
- CFRP
- 10-12
Thermal Properties
- Operating temperature (°C)
- -40 to +180
- Storage Temperature (°C)
- 2-7
Features
- Cure speed (induction)
- <3 minutes
- TG Value
- 130°C
Product Description
Permabond ES569 is a high-temperature resistant 1K epoxy — an industry-standard heat-cure for demanding heat applications.
High-temperature 1K epoxy for industrial bonding applications under heat stress.
High-temperature resistant 1K epoxy — industrial application with heat curing and extended temperature reserve.
What distinguishes Permabond ES569
What is Permabond ES569 used for?
Processing
Recommended accessories
Important Notes
Which Permabond 1K epoxy for which application?
Permabond ES569 in direct comparison with related products of the ES series.
Permabond ES569 Current Product | Permabond ES566 → | Permabond ES578 → | Permabond ES5691 → | |
|---|---|---|---|---|
| Application | High-temperature 1K epoxy — Heat-cure | Comparable | With UL94-V0 | Variant with IR curing |
| Chemistry | One-component epoxy resin (heat-cure, high-temperature) | 1K epoxy | 1K epoxy | 1K epoxy |
| Curing | Heat curing | Heat-cure | Heat-cure | Heat-cure |
Frequently asked questions about Permabond ES569
Practical application and design questions — answered by SILITECH.
High-temperature resistant 1K epoxy — industrial application with heat curing. 1K epoxies are processed directly without mixing and cured in a single heat-cure step.
1K epoxies are processed directly from the container without mixing — no pot life limitation, no mixing errors. Disadvantage: heat curing required (industrial oven, IR lamp, or hot air). 2K epoxies cure at room temperature but require precise mixing and have a limited pot life. 1K is suitable for line production with heat-cure infrastructure, 2K for workshops without an oven.
Heat curing. For exact conditions, refer to the Permabond TDS — typically 30 minutes at 150 °C or equivalent heat input (e.g., 60 min @ 120 °C).
1K heat-cure epoxies bond metals (steel, aluminum, copper), composites (CFK, GFK), ceramics, and selected plastics (with heat resistance). Substrates must tolerate the curing temperature (typically 150 °C).
Permabond ES569 does not have specific industry approvals such as UL94-V0 (see ES578 for the flame-retardant variant). For general industrial applications, the product is approved according to Permabond standards.
At 5 to 25 °C. 1K heat-cure epoxies have limited storage stability — reactivity decreases with higher storage temperature. For long shelf life, store refrigerated. Allow adhesive to warm to room temperature before opening.
From the Permabond 1K epoxy series: Permabond ES569 (high-temperature 1K epoxy — heat-cure); Permabond ES566 (high-temperature 1K); Permabond ES578 (UL94-V0); Permabond ES5691 (1K variant). For UL94-V0 fire protection, see ES578; for high temperature, see ES566/ES569; for IR/hot air curing (without an industrial oven), see ES5691.