Silicones, silicone oils, sprays
Casting and potting resins)
)
Technical Data
Typical values, not a specification. The technical data sheet (TDS) is binding.
Product Information
- Brand
- Permabond
- Manufacturer
- Permabond Engineering Adhesives Ltd
- Container
- 3 x 3 g, 10 x 3 g, 50 x 3 g
- Product type
- 2-component epoxy adhesive
- Application
- Universal adhesive for small components
- Mixing Ratio
- 1:1
- Working time (pot life) at 25°C
- 3–4 minutes
- Temperature resistance
- -40 °C to briefly over 150 °C
Performance at Full Cure
- Shear strength (steel)
- 12–18 N/mm² (ISO 4587)
- Peel strength (aluminum)
- 5–20 N/25 mm (ISO 4578)
- Elongation at break
- <5% (ISO 37)
- Dielectric Strength
- 15–25 kV/mm
Bonding Properties
- Hand strength
- 15-30 minutes
- Functional Strength
- 30-60 minutes
Physical Properties
- Color
- light amber color
- Viscosity at 25°C (resin/hardener)
- 55,000 mPa s / 10,000 mPa s
- Density
- 1.2 / 1.1 g/cm³
Mechanical properties
- Maximum gap filling capacity
- 2 mm
- Glass transition temperature
- 40–50 °C
- Hardness (Shore D)
- 70–80 (ISO 868)
Thermal Properties
- Thermal conductivity
- 0.22 W/m·K
Product Description
Permabond Double / Bubble E01 is a 2K fast-setting epoxy adhesive in a convenient pouch format — mobile bonding without tools, curing at room temperature, ideal for maintenance and repair on the go.
Permabond two-component epoxy adhesives — room temperature curing, with good gap filling, excellent multi-substrate adhesion, and potting suitability. Double/Bubble E01 is tailored to specific applications — the most important properties and areas of use are listed below.
Permabond Double/Bubble E01 is a two-component epoxy resin in a convenient double pouch — components A and B are mixed directly in the pouch; no additional tools are required. It cures quickly at room temperature, making it ideal for maintenance and mobile applications.
What distinguishes Double/Bubble E01
What is Double/Bubble E01 used for?
Processing
Recommended accessories
Double/Bubble E01 in comparison
Direct comparison with related Permabond products from our range.
Double/Bubble E01 Current Product |
MT382 → | MT3821 → | MT 3809 → | |
|---|---|---|---|---|
| Chemical Base | 2K Epoxy | 2K modified epoxy | 2K modified epoxy (flexible) | 2K structural adhesive |
| Viscosity | pasteus | self-leveling | thixotropic | see TDS |
| Grade | Industrial | Industrial | Industrial | Industrial |
| Color | see TDS | see TDS | black | see TDS |
| Set Time | a few minutes | min. | min. | see TDS |
| Full Cure | 24 h RT | 24 h RT | 24 h RT | see TDS |
| Main application | Mobile repair | Engineering plastics + potting | Flexible adhesive, black | MT series structural bonding |
Frequently Asked Questions about Double/Bubble E01
Practical application and design questions — answered by SILITECH.
Permabond Double / Bubble E01: 2-component fast-setting epoxy adhesive in a convenient pouch format — mobile bonding without tools, cures at room temperature, ideal for maintenance and repair on the go. Main applications: Mobile repair, small component assembly, workshop maintenance.
Selection criteria: 1) Substrate (engineering plastics such as nylon/ABS/PC require modified epoxies like MT382), 2) Gap width (large gaps: thixotropic variants), 3) Flexibility (tolerance compensation: flexible variants like MT3821), 4) Mixing ratio (1:1 simple, 2:1 or 10:1 for defined properties), 5) Pot life (short for high throughput, long for careful processing). SILITECH provides consultation for selection.
Store in the unopened original container in a dry, cool place — Permabond adhesives typically between +5 and +25 °C, exact values see TDS. Consult the Safety Data Sheet (SDS) before use. Observe the expiry date on the packaging. Store cyanoacrylates cool (ideally refrigerated) for maximum shelf life.
In the comparison table above, you will find related Permabond products with different properties — viscosity, mixing ratio, special certification. If you are unsure about the optimal choice, we will be happy to advise you — contact SILITECH with your specific application (substrate pairing, load, curing condition).