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PERMABOND 4ES70

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Permabond 4ES70 — Epoxy structural adhesive.

1K heat-curing epoxy adhesive specifically for needle mounting in medical devices — fast curing at low temperatures, high shear and peel strength

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PERMABOND Adhesives PERMABOND 4ES70

 
General Terms and Conditions.

Shipping usually within 1 to 3 business days
(availability will be confirmed after ordering)

. Express logistics. Fast and reliable within Switzerland & Europe.

Shipping from Swiss warehouse within 24 hours. Batch certificate. Invoice within 30 days (B2B). Technical support.
Shipping & Delivery

Usually 1 to 3 working days

Availability will be confirmed after order receipt.

Express logistics within Switzerland & Europe.

General Terms and Conditions →

Product data

Internal reference: 49-4ES70.FL.K001


Internal reference: 49-4ES70.FL.K001

PERMABOND 4ES70
PERMABOND 4ES70
Permabond · SKU 49-4ES70.FL.K001

Permabond 4ES70 is a 1K heat-curing epoxy adhesive specifically for needle mounting in medical devices — fast curing at low temperatures, high shear and peel strength.

Permabond one-component epoxy adhesives — thermosetting, solvent-free, with high shear and peel strength, ideal for needle mounting, sensors, and structural bonding. 4ES70 is tailored to specific applications — the most important properties and areas of use are listed below.

Needle assembly Medical Grade

Permabond 4ES70 is optimized for needle mounting in medical devices — a 1K heat-curing epoxy adhesive that cures quickly at low temperatures. It offers high shear and peel strength, and high temperature resistance after curing.

4ES70 in numbers
1K epoxy
warmth
Low temperature
Cure
Needle assembly
Medical
Shear+Peel
high strength

What makes 4ES70 stand out

Specifically for needle mounting
Optimized for medical needle bonding.
Fast curing at low temperatures
High-throughput production with low heat load.
Convenient application without mixing
1K system — no A/B mixing.
High shear and peel strength
Structural bonding in medical devices.
High temperature resistance after curing
Stable within the service temperature range.

What is the 4ES70 used for?

Needle assembly
Medical needles, syringes, lancets.
Medical device structural bonding
High-strength connections in medical devices.
Sensor bonding
Sensitive components with low-temperature cure.
High-throughput production
Rapid heat curing in series production.
Structural industrial bonding
High-strength connections.
Data sheets & safety data sheet
TDS and SDS in multiple languages ​​— watch or download directly.
To the documents →

processing

1
clean substrate
Carefully degrease bonding surfaces — cleanroom conditions for medical device applications.
2
Apply adhesive
1K epoxy directly from syringe or cartridge — no mixing required.
3
assembling components
Add within the processing time — no pot life limit for 1K epoxy.
4
Heat curing
Cure at the specified temperature (see TDS) — typically 80–150 °C, time according to TDS.
5
Final strength
Full strength is achieved immediately after heat curing. High shear and peel strength is attained.

Recommended accessories


4ES70 in comparison

Direct comparison with related Permabond products in our range.

4ES70
Current product
Double/Bubble E01 →MT382 →MT3821 →
Chemical basis1K epoxy2K epoxy2K modified epoxy2K modified epoxy (flexible)
viscositysee TDSpasteusself-levelingthixotropic
GradeMedical DeviceIndustrialIndustrialIndustrial
Colorsee TDSsee TDSsee TDSblack
SetTimeheat-activateda few minutesmin.min.
Full Cureheat-dependent24 h RT24 h RT24 h RT
Main applicationNeedle assembly MedicalMobile repairEngineering plastics + pottingFlexible adhesive, black
Topics & Application Areas
Key terms related to this product. Also useful for our search and filters.
PERMABOND Adhesives PERMABOND 4ES70

Technical data for PERMABOND 4ES70

Product information
brand Permabond
Container 1 kg

For binding values, please refer to the technical data sheet (TDS) in the "Documents" tab.

Documents and datasheets

Click on a document for a preview or the download icon for a direct download.

Technical Data Sheets (TDS) 2
Permabond 4ES70 - Technical Data Sheet DE.pdf
315 KB
Permabond 4ES70 - Technical Data Sheet EN.pdf
314 KB
Safety Data Sheets (SDS) 2
Permabond 4ES70 - Safety Data Sheet EN.pdf
376 KB
Permabond 4ES70 - Fiche de Sécurité FR.pdf
380 KB

Frequently asked questions about 4ES70

Practical application and design questions — answered by SILITECH.

Permabond 4ES70: A one-component, heat-curing epoxy adhesive specifically designed for needle mounting in medical devices — fast curing at low temperatures, high shear and peel strength. Main applications: needle mounting, medical device structural bonding, sensor bonding.

One-component epoxies are pre-activated and crosslink under heat—no mixing, no pot life stress. Advantages: simple application, long storage of the ready-to-use mixture (refrigerated). Disadvantages: heat curing is required, energy consumption for curing. Preferred for high-throughput production with a defined heat-cure schedule (e.g., medical device needle assembly).

Store in the unopened original container in a dry, cool place — Permabond adhesives typically between +5 and +25 °C, see TDS for exact values. Consult the Safety Data Sheet (SDS) before use. Observe the expiry date on the packaging. Store cyanoacrylates in a cool place (ideally refrigerated) for maximum shelf life.

The comparison table above lists related Permabond products with different properties—viscosity, mixing ratio, special certification. If you are unsure which product is best, we would be happy to advise you—contact SILITECH with your specific application (substrate pairing, load, curing conditions).

Your question isn't listed here

Our technical team will advise you personally on material selection, processing questions, and individual requirements. Quickly and competently.

Product specifications

brand Permabond
Container 1 kg
Keywords
Keywords
PERMABOND Adhesives PERMABOND 4ES70