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Permabond Engineering Adhesives LtdEpoxy Adhesives (1-K & 2-K)

PERMABOND ES558

1K heat-curing epoxy adhesive — industry standard.

Chemical group
Epoxy resin
Color
silver-grey
Specific Gravity
1.5
Viscosity (adhesives)
High viscosity >5000 mPas

CHF 0.00 / ml
  • Manufacturer
  • Brand
  • Container
  • Color
  • Country of origin
  • Chemical group
  • Viscosity (adhesives)
  • Viscosity mPa.s
  • Specific Gravity
  • Operating temperature (°C)
  • Hardness (Shore D)
  • Storage Temperature (°C)
  • Maximum gap fill (mm)
  • Steel
  • Aluminum
  • Zinc
  • Shear strength (steel ISO10123)
  • Impact strength (ASTM D-950)
  • Thermal conductivity
  • 130° C
  • 150°C
  • 170°C
  • UFI (Unique Formula Identifier)
Your selection PERMABOND ES558 49-558.KT.ML320
General terms and conditions of business

Internal reference: 49-558.KT.ML320
HS code: 3506.9190000

PERMABOND ES558 Sample Offer

Technical Data

Typical values, not a specification. The technical data sheet (TDS) is binding.

Product Information

Manufacturer
Permabond Engineering Adhesives Ltd
Brand
Permabond
Container
320 ml
Country of origin
Italy
UFI (Unique Formula Identifier)
S9K0-R0GF-Y00T-JP9P

Cure speed (oven)

130° C
75 minutes
150°C
60 minutes
170°C
40 minutes

Performance at Full Cure

Shear strength (steel ISO10123)
>14 N/mm²
Impact strength (ASTM D-950)
25-35 kJ/m²
Thermal conductivity
0.9 W/(mK)

Physical Properties

Color
silver-grey
Chemical group
Epoxy resin
Viscosity (adhesives)
High viscosity >5000 mPas
Viscosity mPa.s
100000-300000
Specific Gravity
1.5

Curing values

Maximum gap fill (mm)
0.5

Mechanical properties

Hardness (Shore D)
80-85

Shear strength ISO 4587 in N/mm²

Steel
27 - 41 N/mm²
Aluminum
17 - 31 N/mm²
Zinc
14 - 27 N/mm²

Thermal Properties

Operating temperature (°C)
-40 to +180
Storage Temperature (°C)
2-7
Keywords
  • Metal
  • Ceramic
  • Ferrites
  • Composite Materials

Product Description

Permabond ES558 is a 1K epoxy adhesive for heat curing — industrial application with heat-cure infrastructure.

1K standard epoxy for industrial heat-cure bonding.

APPLICATION PROFILE

1K epoxy resin adhesive for heat curing — standard industrial variant without pot life limitation.

Permabond ES558 in figures
1K
One-component
Heat-cure
Heat curing
No pot life
Can be processed directly
Industry
Standard

What distinguishes Permabond ES558

1K System
No mixing.
Heat-cure
Heat curing.
No pot life
Remains liquid until heated.
Industry standard
All-round application.
Solvent-free
100% reactive.
Multi-Substrate
Metal, composite, plastic.

What is Permabond ES558 used for?

Industrial heat-cure bonding
With furnace infrastructure.
Composite bonding
Heat-curable.
Mass production
Line production.
Multi-material
Various substrates.
Standard industrial adhesive
1K advantages.

Processing

1
Clean surfaces
Prepare bonding surfaces clean, dry, and free of grease — degrease with Permabond Cleaner A. Lightly sand aluminum and copper to remove the oxide layer.
2
Apply adhesive directly
Apply Permabond ES558 directly from the container without mixing — as a 1K system, there is no pot life limitation. Avoid air bubbles.
3
Join and fix components
Join components with sufficient pressure. Use a clamping device or clamp to prevent the parts from moving during curing.
4
Perform heat curing
Curing occurs through heat application — heat curing. Typical conditions: 30 minutes at 150 °C in an industrial oven or with equivalent IR/hot air curing. See TDS for exact values.
5
Final strength after cooling
After heat curing, allow the component to cool down — full strength is achieved immediately after cooling. Unlike 2K epoxies at room temperature, there is no 24-hour waiting period.
Data Sheets & Safety Data Sheet
Complete TDS and SDS in DE, EN, FR — view or download directly.
To the documents →

Recommended accessories


Important Notes

Important Notes
Heat curing required. Store at 5–25 °C.
Storage
Store at 5 to 25 °C. 1K heat-cure epoxies have limited storage stability — reactivity decreases with higher storage temperature. Observe the expiration date.

Which Permabond 1K epoxy for which application?

Permabond ES558 in direct comparison with related products of the ES series.

Permabond ES558
Current Product
Permabond ES550 →Permabond ES578 →Permabond ES562 →
ApplicationStandard 1K epoxy — heat curingComparableFlame-retardantStandard EN variant
ChemistryOne-component epoxy resin (heat-cure)1K epoxy1K epoxy1K epoxy
CuringHeat curingHeat-cureHeat-cureHeat-cure

Frequently asked questions about Permabond ES558

Practical application and design questions — answered by SILITECH.

One-component (1K) epoxy adhesive for heat curing — industrial application with no pot life. One-component epoxies are processed directly without mixing and cured in a single heat-cure step.

1K epoxies are processed directly from the container without mixing — no pot life limitation, no mixing errors. Disadvantage: heat curing required (industrial oven, IR lamp, or hot air). 2K epoxies cure at room temperature but require precise mixing and have a limited pot life. 1K is suitable for line production with heat-cure infrastructure, 2K for workshops without an oven.

Heat curing. For exact conditions, refer to the Permabond TDS — typically 30 minutes at 150 °C or equivalent heat input (e.g., 60 min @ 120 °C).

1K heat-cure epoxies bond metals (steel, aluminum, copper), composites (CFK, GFK), ceramics, and selected plastics (with heat resistance). Substrates must tolerate the curing temperature (typically 150 °C).

Permabond ES558 does not have specific industry approvals such as UL94-V0 (see ES578 for the flame-retardant version). For general industrial applications, the product is approved according to Permabond standards.

At 5 to 25 °C. 1K heat-cure epoxies have limited storage stability — reactivity decreases with higher storage temperature. For long shelf life, store refrigerated. Allow adhesive to warm to room temperature before opening.

From the Permabond 1K epoxy range: Permabond ES558 (standard 1K epoxy — heat cure); Permabond ES550 (standard 1K); Permabond ES578 (UL94-V0); Permabond ES562 (single-part heat cure). For UL94-V0 fire protection, see ES578; for high temperature, see ES566/ES569; for IR/hot air curing (without an industrial oven), see ES5691.