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PERMABOND ES564

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Permabond ES564 — Epoxy structural adhesive, Shore D >70.

Special 1K epoxy ES564 — Engineering applications with SILITECH consulting.

Price on request

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  • Brand
  • Container
  • Color
  • Country of origin
  • Viscosity at 20 rpm
  • Chemical group
  • Viscosity (adhesives)
  • Operating temperature (°C)
  • Hardness (Shore D)
  • Storage Temperature (°C)
  • Maximum gap fill (mm)
  • 100°C
  • 120°C
  • 130° C
  • Cure speed (induction)
  • Steel
  • UFI (Unique Formula Identifier)

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General Terms and Conditions

Shipping usually within 1 to 3 business days
(Availability confirmed after order)

Express logistics. Fast and reliable within Switzerland & Europe

From Swiss stock Dispatch within 24h Batch certificate Invoice 30 days (B2B) Technical advice
Shipping & Delivery

Usually 1 to 3 business days

Availability is confirmed after order receipt.

Express logistics within Switzerland & Europe.

Terms and Conditions →

Product data

Internal reference: 49-564.KT.ML320

HS Code: 3506.9190000

Internal reference: 49-564.KT.ML320
HS code: 3506.9190000

PERMABOND ES564
PERMABOND ES564
Permabond · Permabond Engineering Adhesives Ltd · SKU 49-564.KT.ML320

Permabond ES564 is a special 1K epoxy — engineering variant with specific applications.

Engineering special 1K epoxy with Permabond/SILITECH consulting.

PRODUCT NOTE

Special 1K epoxy for engineering applications — technical data available via SILITECH distribution.

Permabond ES564 in figures
1K
Single-part
Engineering
Special
Heat-cure
Heat curing
Consulting
About SILITECH

What distinguishes Permabond ES564

1K System
No mixing.
Engineering Special
Specific applications.
Heat-cure
Heat curing.
SILITECH consultation
Via sales.
Solvent-free
100% reactive.
Original Permabond
Manufacturer original.

What is Permabond ES564 used for?

Engineering applications
Special requirements.
Industrial special solutions
With consultation.
R&D area
Test applications.
Custom bonding
Application-specific.
Industry Premium
With consultation.

Processing

1
Clean surfaces
Prepare bonding surfaces clean, dry, and free of grease — degrease with Permabond Cleaner A. Lightly sand aluminum and copper to remove the oxide layer.
2
Apply adhesive directly
Apply Permabond ES564 directly from the container without mixing — as a 1K system, there is no pot life limitation. Avoid air bubbles.
3
Join and fix components
Join components with sufficient pressure. Use a clamping device or clamp to prevent the parts from moving during curing.
4
Perform heat curing
Curing occurs through heat application — heat curing. Typical conditions: 30 minutes at 150 °C in an industrial oven or with equivalent IR/hot air curing. See TDS for exact values.
5
Final strength after cooling
After heat curing, allow the component to cool down — full strength is achieved immediately after cooling. Unlike 2K epoxies at room temperature, there is no 24-hour waiting period.
Data Sheets & Safety Data Sheet
Complete TDS and SDS in DE, EN, FR — view or download directly.
To the documents →

Recommended accessories

Permabond Cleaner A Aerosol
Spray cleaner for quick preparation of bonding surfaces before applying the 1K heat-cure epoxy.
To the product →
Permabond ES578 — UL94-V0
Flame-retardant 1K epoxy per Underwriter's Laboratory standard — for safety-critical industrial applications.
To the product →
Permabond ES566 — High Temperature
High-temperature resistant 1K epoxy for demanding thermal applications.
To the product →
Permabond ES5691 — IR/Hot Air
1K epoxy with IR lamp or hot air curing — flexible without an industrial oven.
To the product →

Important Notes

Important Notes
Clarify with SILITECH sales before ordering.
Storage
Store at 5 to 25 °C. 1K heat-cure epoxies have limited storage stability — reactivity decreases with higher storage temperature. Observe the expiration date.

Which Permabond 1K epoxy for which application?

Permabond ES564 in direct comparison with related products of the ES series.

Permabond ES564
Current Product		Permabond ES550 →Permabond ES578 →Permabond ES560 →
ApplicationSpecial 1K epoxy (Engineering)StandardFlame-retardantComparable Engineering
ChemistryOne-component epoxy resin1K epoxy1K epoxy1K epoxy
CuringHeat-cureHeat-cureHeat-cureHeat-cure
Topics & Application Fields
Key terms related to this product. Also useful for our search and filters.
Plastic

Technical data for PERMABOND ES564

All 18 product information 5 Curing speed (oven) 3 Physical properties 4 Curing values ​​1 Mechanical properties 1 Shear strength ISO 4587 in N/mm² 1 Thermal properties 2 General 1
Product Information
Manufacturer Permabond Engineering Adhesives Ltd
Brand Permabond
Container 320 ml
Country of origin Italy
UFI (Unique Formula Identifier) 6VX0-20P2-A00M-VRYD
Cure speed (oven)
100°C 45 minutes
120°C 20 minutes
130° C 15 minutes
Physical Properties
Color black
Viscosity at 20 rpm 50000-180000
Chemical group Epoxy resin
Viscosity (adhesives) High viscosity >5000 mPas
Curing values
Maximum gap fill (mm) 2
Mechanical properties
Hardness (Shore D) >70
Shear strength ISO 4587 in N/mm²
Steel 12-14
Thermal Properties
Operating temperature (°C) -40 to +180
Storage Temperature (°C) 2-7
General
Cure speed (induction) <3 minutes

Please refer to the technical data sheet (TDS) in the "Documents" tab for binding values.

Documents and data sheets

Click on a document for the preview or the download icon for direct download.

Technical Data Sheets (TDS) 2
Permabond ES564 - Technical Data Sheet EN.pdf
521 KB
Permabond ES564 - Technical Data Sheet EN.pdf
370 KB

Frequently asked questions about Permabond ES564

Practical application and design questions — answered by SILITECH.

Special 1K epoxy for engineering applications — technical advice available from SILITECH. 1K epoxies are processed directly without mixing and cured in a single heat-cure step.

1K epoxies are processed directly from the container without mixing — no pot life limitation, no mixing errors. Disadvantage: heat curing required (industrial oven, IR lamp, or hot air). 2K epoxies cure at room temperature but require precise mixing and have a limited pot life. 1K is suitable for line production with heat-cure infrastructure, 2K for workshops without an oven.

Heat curing. For exact conditions, refer to the Permabond TDS — typically 30 minutes at 150 °C or equivalent heat input (e.g., 60 min @ 120 °C).

1K heat-cure epoxies bond metals (steel, aluminum, copper), composites (CFK, GFK), ceramics, and selected plastics (with heat resistance). Substrates must tolerate the curing temperature (typically 150 °C).

Permabond ES564 does not have specific industry approvals such as UL94-V0 (see ES578 for the flame-retardant variant). For general industrial applications, the product is approved according to Permabond standards.

At 5 to 25 °C. 1K heat-cure epoxies have limited storage stability — reactivity decreases with higher storage temperature. For long shelf life, store refrigerated. Allow adhesive to warm to room temperature before opening.

From the Permabond 1K epoxy range: Permabond ES564 (Special 1K epoxy (Engineering)); Permabond ES550 (Standard 1K); Permabond ES578 (UL94-V0); Permabond ES560 (Engineering). For UL94-V0 fire protection, see ES578; for high temperature, see ES566/ES569; for IR/hot air curing (without an industrial oven), see ES5691.

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Product Specifications

Product Information
Manufacturer Permabond Engineering Adhesives Ltd
Brand Permabond
Container 320 ml
Country of origin Italy
UFI (Unique Formula Identifier) 6VX0-20P2-A00M-VRYD
Cure speed (oven)
100°C 45 minutes
120°C 20 minutes
130° C 15 minutes
Physical Properties
Color black
Viscosity at 20 rpm 50000-180000
Chemical group Epoxy resin
Viscosity (adhesives) High viscosity >5000 mPas
Curing values
Maximum gap fill (mm) 2
Mechanical properties
Hardness (Shore D) >70
Shear strength ISO 4587 in N/mm²
Steel 12-14
Thermal Properties
Operating temperature (°C) -40 to +180
Storage Temperature (°C) 2-7
Uncategorized
Cure speed (induction) <3 minutes
Keywords
Keywords
Plastic

Documents and data sheets

Safety Data Sheets (SDS) and Technical Data Sheets (TDS) for download: