Silicones, silicone oils, sprays
Casting and potting resins
Internal reference:
49-560.FL.ML200
HS code:
3506.9190000
Technical Data
Typical values, not a specification. The technical data sheet (TDS) is binding.
Product Information
- Manufacturer
- Permabond Engineering Adhesives Ltd
- Brand
- Permabond
- Container
- 200 ml
- Country of origin
- Italy
- UFI (Unique Formula Identifier)
- K7Y0-30EN-J00M-H49N
Performance at Full Cure
- Thermal conductivity
- 0.1 W/(mK)
- Dielectric strength
- 22 kV/mm
Properties of the permanent bond
- Peel resistance (ISO 4578)
- 40 N/ 25 mm
Physical Properties
- Color
- transparent
- Chemical group
- Epoxy resin
- Viscosity (adhesives)
- Medium viscosity 500 - 5000 mPas
- Viscosity mPa.s
- 1000-3000
- Specific Gravity
- 1.2
Electrical Properties
- Dielectric Constant
- 4,5
Curing values
- Maximum gap fill (mm)
- 0.1
Mechanical properties
- Hardness (Shore D)
- 80
Shear strength ISO 4587 in N/mm²
- Steel
- Steel 14 - 20 N/mm²
Thermal Properties
- Operating temperature (°C)
- -40 to +150
- Storage Temperature (°C)
- 2-7
- Coefficient of thermal expansion
- 45 x 10⁻⁶ mm/mm/°C
Features
- TG Value
- 110°C
- Cure speed (induction)
- <3 minutes
Product Description
Permabond ES560 is a special 1K epoxy for engineering applications — technical specifications available upon request from SILITECH or Permabond directly.
Engineering 1K epoxy for specific industrial applications — Permabond/SILITECH consultation recommended.
Special 1K epoxy for engineering applications — technical data and application advice available through SILITECH sales.
What makes Permabond ES560 stand out
What is Permabond ES560 used for?
Processing
Recommended accessories
Important Notes
Which Permabond 1K epoxy for which application?
Permabond ES560 in direct comparison with related products of the ES series.
Permabond ES560 Current Product | Permabond ES550 → | Permabond ES578 → | Permabond ES566 → | |
|---|---|---|---|---|
| Application | Special 1K epoxy (Engineering) | Standard | Flame-retardant | Premium high-temperature |
| Chemistry | One-component epoxy resin | 1K epoxy | 1K epoxy | 1K epoxy |
| Curing | Heat-cure | Heat-cure | Heat-cure | Heat-cure |
Frequently asked questions about Permabond ES560
Practical application and design questions — answered by SILITECH.
Special 1K epoxy for engineering applications — technical advice available from SILITECH. 1K epoxies are processed directly without mixing and cured in a single heat-cure step.
1K epoxies are processed directly from the container without mixing — no pot life limitation, no mixing errors. Disadvantage: heat curing required (industrial oven, IR lamp, or hot air). 2K epoxies cure at room temperature but require precise mixing and have a limited pot life. 1K is suitable for line production with heat-cure infrastructure, 2K for workshops without an oven.
Heat curing. For exact conditions, refer to the Permabond TDS — typically 30 minutes at 150 °C or equivalent heat input (e.g., 60 min @ 120 °C).
1K heat-cure epoxies bond metals (steel, aluminum, copper), composites (CFK, GFK), ceramics, and selected plastics (with heat resistance). Substrates must tolerate the curing temperature (typically 150 °C).
Permabond ES560 does not have specific industry approvals such as UL94-V0 (see ES578 for the flame-retardant variant). For general industrial applications, the product is approved according to Permabond standards.
At 5 to 25 °C. 1K heat-cure epoxies have limited storage stability — reactivity decreases with higher storage temperature. For long shelf life, store refrigerated. Allow adhesive to warm to room temperature before opening.
From the Permabond 1K epoxy range: Permabond ES560 (Special 1K epoxy (Engineering)); Permabond ES550 (Standard 1K); Permabond ES578 (UL94-V0); Permabond ES566 (High Temperature). For UL94-V0 fire protection, see ES578; for high temperature, see ES566/ES569; for IR/hot air curing (without an industrial oven), see ES5691.