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PERMABOND ES560

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Permabond ES560 — Epoxy structural adhesive, viscosity 1000-3000 mPa·s, Shore D 80.

Special 1K epoxy ES560 — Engineering applications with SILITECH consulting.

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  • Country of origin
  • Chemical group
  • Viscosity (adhesives)
  • Viscosity mPa·s
  • Specific gravity
  • Operating temperature (°C)
  • Hardness (Shore D)
  • Storage temperature (°C)
  • Maximum gap width (mm)
  • Steel
  • Thermal conductivity
  • coefficient of thermal expansion
  • Peel resistance (ISO 4578)
  • TG value
  • dielectric constant
  • Dielectric strength
  • Curing speed (induction)
  • UFI (Unique Formula Identifier)

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impact-resistant, flowable epoxy resin

 
General Terms and Conditions.

Shipping usually within 1 to 3 business days
(availability will be confirmed after ordering)

. Express logistics. Fast and reliable within Switzerland & Europe.

Shipping from Swiss warehouse within 24 hours. Batch certificate. Invoice within 30 days (B2B). Technical support.
Shipping & Delivery

Usually 1 to 3 working days

Availability will be confirmed after order receipt.

Express logistics within Switzerland & Europe.

General Terms and Conditions →

Product data

Internal reference: 49-560.FL.G200

HS code: 3506.9190000


Internal reference: 49-560.FL.G200
HS code: 3506.9190000

PERMABOND ES560
PERMABOND ES560
Permabond · Permabond Engineering Adhesives Ltd · SKU 49-560.FL.G200

Permabond ES560 is a special 1K epoxy for engineering applications — technical specifications available upon request from SILITECH or Permabond directly.

Engineering 1K epoxy for specific industrial applications — Permabond/SILITECH consultation recommended.

PRODUCT INFORMATION

Special 1K epoxy for engineering applications — technical data and application advice available through SILITECH sales.

Permabond ES560 in figures
1K
Single-part
Engineering
Special
Heat Cure
Heat curing
Advice
About SILITECH

What makes Permabond ES560 stand out

1K system
Do not mix.
Engineering Specialist
Specific applications.
Heat Cure
Heat curing.
SILITECH Consulting
Available through sales channels.
Solvent-free
100% reactive.
Original Permabond
Manufacturer's original.

What is Permabond ES560 used for?

Engineering applications
Special requirements.
Industrial special solutions
With consultation.
R&D area
Test and pilot applications.
Custom adhesives
Application-specific.
Industry Premium
With manufacturer consultation.

processing

1
Clean surfaces
Prepare bonding surfaces to be clean, dry, and free of grease — degrease with Permabond Cleaner A. Lightly sand aluminum and copper to remove oxide layers.
2
Apply adhesive directly
Apply Permabond ES560 directly from the container without mixing — as a 1K system, there is no pot life limitation. Avoid air bubbles.
3
Add and fix components
Assemble the components with sufficient pressure. Use a clamping device or vise to prevent the parts from moving during curing.
4
Perform heat curing
Curing is achieved through heat application — heat curing. Typical conditions: 30 minutes at 150 °C in an industrial oven or equivalent IR/hot air curing. See TDS for exact values.
5
Final strength after cooling
After heat curing, allow the component to cool down – final strength is reached immediately after cooling. Unlike with 2-component epoxies at room temperature, there is no 24-hour waiting time.
Data sheets & safety data sheet
Full TDS and SDS in DE, EN, FR — view or download directly.
To the documents →

Recommended accessories


Important instructions

Important instructions
Before ordering, clarify with SILITECH sales about application conditions, heat curing and compatibility.
storage
Store between 5 and 25 °C. 1K heat-cure epoxides have limited storage stability—reactivity decreases with increasing storage temperature. Observe the expiration date.

Which Permabond 1K epoxy is suitable for which application?

Permabond ES560 in direct comparison with related products of the ES series.

Permabond ES560
Current product
Permabond ES550 →Permabond ES578 →Permabond ES566 →
ApplicationSpecial 1K epoxy (engineering)standardFlame retardantPremium high-temperature
ChemistryOne-component epoxy resin1K epoxy1K epoxy1K epoxy
CuringHeat CureHeat CureHeat CureHeat Cure
Topics & Application Areas
Key terms related to this product. Also useful for our search and filters.
impact-resistant, flowable epoxy resin

Technical data for PERMABOND ES560

All 22 product information 5 Performance at final strength 2 Properties of the final bond 1 Physical properties 5 Electrical properties 1 Curing values ​​1 Mechanical properties 1 Shear strength ISO 4587 in N/mm² 1 Thermal properties 3 General 2
Product information
Manufacturer Permabond Engineering Adhesives Ltd
brand Permabond
Container 200 ml
Country of origin Italy
UFI (Unique Formula Identifier) K7Y0-30EN-J00M-H49N
Performance at final strength
Thermal conductivity 0.1 W/(mK)
Dielectric strength 22 kV/mm
Properties of the permanent bond
Peel resistance (ISO 4578) 40 N/ 25 mm
Physical properties
Color transparent
Chemical group epoxy resin
Viscosity (adhesives) Medium viscosity 500 - 5000 mPas
Viscosity mPa·s 1000-3000
Specific gravity 1.2
Electrical properties
dielectric constant 4,5
Curing values
Maximum gap width (mm) 0.1
Mechanical properties
Hardness (Shore D) 80
Shear strength ISO 4587 in N/mm²
Steel Steel 14 - 20 N/mm²
Thermal properties
Operating temperature (°C) -40 to +150
Storage temperature (°C) 2-7
coefficient of thermal expansion 45 x 10⁻⁶ mm/mm/°C
Generally
TG value 110°C
Curing speed (induction) <3 minutes

For binding values, please refer to the technical data sheet (TDS) in the "Documents" tab.

Documents and datasheets

Click on a document for a preview or the download icon for a direct download.

Technical Data Sheets (TDS) 4
Permabond ES560 - Technical Data Sheet DE.pdf
530 KB
Permabond ES560 - Technical Data Sheet DE.pdf
379 KB
Permabond ES560 - Technical Data Sheet EN.pdf
370 KB
Permabond ES560 - Technical Data Sheet EN.pdf
523 KB
Safety Data Sheets (SDS) 3
Permabond ES560 - Safety Data Sheet DE.pdf
402 KB
Permabond ES560 - Safety Data Sheet EN.pdf
397 KB
Permabond ES560 - Fiche de Sécurité FR.pdf
401 KB

Frequently asked questions about Permabond ES560

Practical application and design questions — answered by SILITECH.

Special 1K epoxy for engineering applications — technical advice available from SILITECH. 1K epoxies are processed directly without mixing and cured in a single heat-cure step.

One-component (1K) epoxies are processed directly from the container without mixing—no pot life limitations, no mixing errors. Disadvantage: Heat curing is required (industrial oven, IR lamp, or hot air). Two-component (2K) epoxies cure at room temperature but require precise mixing and have a limited pot life. One-component (1K) epoxies are suitable for line production with heat-curing infrastructure, while two-component (2K) epoxies are suitable for workshops without an oven.

Heat curing. For exact conditions, see Permabond-TDS — typically 30 minutes at 150 °C or equivalent heat input (e.g. 60 min @ 120 °C).

One-component heat-cure epoxies bond metals (steel, aluminum, copper), composites (CFRP, GFRP), ceramics, and selected heat-resistant plastics. Substrates must tolerate the curing temperature (typically 150 °C).

Permabond ES560 does not have specific industry approvals such as UL94-V0 (see ES578 for the flame-retardant variant). For general industrial applications, the product is approved according to Permabond standards.

Store between 5 and 25 °C. 1K heat-cure epoxies have limited storage stability—reactivity decreases with increasing storage temperature. For long shelf life, store refrigerated. Allow the adhesive to warm to room temperature before opening.

From the Permabond 1K epoxy range: Permabond ES560 (Special 1K epoxy (Engineering)); Permabond ES550 (Standard 1K); Permabond ES578 (UL94-V0); Permabond ES566 (High Temperature). For UL94-V0 fire protection, see ES578; for high temperature, see ES566/ES569; for IR/hot air curing (without an industrial oven), see ES5691.

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Product specifications

Product information
Manufacturer Permabond Engineering Adhesives Ltd
brand Permabond
Container 200 ml
Country of origin Italy
UFI (Unique Formula Identifier) K7Y0-30EN-J00M-H49N
Performance at final strength
Thermal conductivity 0.1 W/(mK)
Dielectric strength 22 kV/mm
Properties of the permanent bond
Peel resistance (ISO 4578) 40 N/ 25 mm
Physical properties
Color transparent
Chemical group epoxy resin
Viscosity (adhesives) Medium viscosity 500 - 5000 mPas
Viscosity mPa·s 1000-3000
Specific gravity 1.2
Electrical properties
dielectric constant 4,5
Curing values
Maximum gap width (mm) 0.1
Mechanical properties
Hardness (Shore D) 80
Shear strength ISO 4587 in N/mm²
Steel Steel 14 - 20 N/mm²
Thermal properties
Operating temperature (°C) -40 to +150
Storage temperature (°C) 2-7
coefficient of thermal expansion 45 x 10⁻⁶ mm/mm/°C
Uncategorized
TG value 110°C
Curing speed (induction) <3 minutes
Keywords
Keywords
impact-resistant, flowable epoxy resin