Skip to content
Website 0 CHF
  1. All Products
  2. PERMABOND ES579
PERMABOND ES579

PERMABOND ES579

https://www.silitech.ch/web/image/product.template/595/image_1920?unique=8ac25b8

Permabond ES579 — Epoxy structural adhesive, viscosity 60000-80000 mPa·s, Shore D 80-85.

1K heat-cure epoxy for industrial applications with heat curing.

Price on request

  • Manufacturer
  • Brand
  • Container
  • Color
  • Country of origin
  • Chemical group
  • Viscosity (adhesives)
  • Viscosity mPa.s
  • Specific Gravity
  • Operating temperature (°C)
  • Hardness (Shore D)
  • Storage Temperature (°C)
  • Maximum gap fill (mm)
  • Thermal conductivity
  • 100°C
  • 120°C
  • 150°C
  • 180°C
  • Steel
  • Aluminum
  • Zinc
  • Coefficient of thermal expansion
  • Peel strength (ISO4578)
  • Dielectric strength
  • TG Value
  • UFI (Unique Formula Identifier)

This combination does not exist.

Contact us
Non-Conductive

 
General Terms and Conditions

Shipping usually within 1 to 3 business days
(Availability confirmed after order)

Express logistics. Fast and reliable within Switzerland & Europe

From Swiss stock Dispatch within 24h Batch certificate Invoice 30 days (B2B) Technical advice
Shipping & Delivery

Usually 1 to 3 business days

Availability is confirmed after order receipt.

Express logistics within Switzerland & Europe.

Terms and Conditions →

Product data

Internal reference: 49-579.KT.ML320

HS Code: 3506.9190000

Internal reference: 49-579.KT.ML320
HS code: 3506.9190000

PERMABOND ES579
PERMABOND ES579
Permabond · Permabond Engineering Adhesives Ltd · SKU 49-579.KT.ML320

Permabond ES579 is a single-part heat-cure 1K epoxy — for industrial applications with heat curing.

Standard 1K heat-cure epoxy for industrial use.

APPLICATION PROFILE

Single-part Heat-Cure 1K Epoxy — Industry-standard heat-curing adhesive.

Permabond ES579 in figures
1K
Single-part
Heat-cure
Heat curing
No pot life
Direct
Industry
Standard

What distinguishes Permabond ES579

Single-part
1K system.
Heat-cure
Heat curing.
No pot life
Direct.
Industry
Standard.
Solvent-free
100% reactive.
Multi-Substrate
Various materials.

What is Permabond ES579 used for?

Industrial heat-cure bonding
With oven.
Composite bonding
Heat curing.
Line production
Mass production.
Multi-material
Various substrates.
Standard industrial
1K advantages.

Processing

1
Clean surfaces
Prepare bonding surfaces clean, dry, and free of grease — degrease with Permabond Cleaner A. Lightly sand aluminum and copper to remove the oxide layer.
2
Apply adhesive directly
Apply Permabond ES579 directly from the container without mixing — as a 1K system, there is no pot life limitation. Avoid air bubbles.
3
Join and fix components
Join components with sufficient pressure. Use a clamping device or clamp to prevent the parts from moving during curing.
4
Perform heat curing
Curing occurs through heat application — heat curing. Typical conditions: 30 minutes at 150 °C in an industrial oven or with equivalent IR/hot air curing. See TDS for exact values.
5
Final strength after cooling
After heat curing, allow the component to cool down — full strength is achieved immediately after cooling. Unlike 2K epoxies at room temperature, there is no 24-hour waiting period.
Data Sheets & Safety Data Sheet
Complete TDS and SDS in DE, EN, FR — view or download directly.
To the documents →

Recommended accessories

Permabond Cleaner A Aerosol
Spray cleaner for quick preparation of bonding surfaces before applying the 1K heat-cure epoxy.
To the product →
Permabond ES578 — UL94-V0
Flame-retardant 1K epoxy per Underwriter's Laboratory standard — for safety-critical industrial applications.
To the product →
Permabond ES566 — High Temperature
High-temperature resistant 1K epoxy for demanding thermal applications.
To the product →
Permabond ES5691 — IR/Hot Air
1K epoxy with IR lamp or hot air curing — flexible without an industrial oven.
To the product →

Important Notes

Important Notes
Heat curing required.
Storage
Store at 5 to 25 °C. 1K heat-cure epoxies have limited storage stability — reactivity decreases with higher storage temperature. Observe the expiration date.

Which Permabond 1K epoxy for which application?

Permabond ES579 in direct comparison with related products of the ES series.

Permabond ES579
Current Product		Permabond ES578 →Permabond ES562 →Permabond ES550 →
ApplicationSingle-part Heat-Cure 1K epoxyFlame-retardantComparableComparable
ChemistryOne-component epoxy resin (heat-cure)1K epoxy1K epoxy1K epoxy
CuringHeat curingHeat-cureHeat-cureHeat-cure
Topics & Application Fields
Key terms related to this product. Also useful for our search and filters.
Non-Conductive

Technical data for PERMABOND ES579

All 26 product information 5 Curing speed (oven) 4 Performance at final strength 2 Physical properties 5 Curing values ​​1 Mechanical properties 1 Shear strength ISO 4587 in N/mm² 3 Thermal properties 3 General 2
Product Information
Manufacturer Permabond Engineering Adhesives Ltd
Brand Permabond
Container 320 ml
Country of origin Italy
UFI (Unique Formula Identifier) E3N0-C0YT-E006-FUJI
Cure speed (oven)
100°C 240 minutes
120°C 60 minutes
150°C 60 minutes
180°C 20 minutes
Performance at Full Cure
Thermal conductivity 0.65 W/(mK)
Dielectric strength 17.7 kV/mm
Physical Properties
Color ivory
Chemical group Epoxy resin
Viscosity (adhesives) High viscosity >5000 mPas
Viscosity mPa.s 60000-80000
Specific Gravity 1,7
Curing values
Maximum gap fill (mm) 2
Mechanical properties
Hardness (Shore D) 80-85
Shear strength ISO 4587 in N/mm²
Steel 27-41
Aluminum 17-31
Zinc 14-27
Thermal Properties
Operating temperature (°C) -40 to +180
Storage Temperature (°C) 2-7
Coefficient of thermal expansion 45 x 10-6 mm/mm/°C (
General
Peel strength (ISO4578) 70 N/25mm
TG Value 105°C

Please refer to the technical data sheet (TDS) in the "Documents" tab for binding values.

Documents and data sheets

Click on a document for the preview or the download icon for direct download.

Technical Data Sheets (TDS) 4
Permabond ES579 - Technical Data Sheet DE.pdf
379 KB
Permabond ES579 - Technical Data Sheet EN.pdf
521 KB
Permabond ES579 - Technical Data Sheet EN.pdf
376 KB
Permabond ES579 - Fiche Technique FR.pdf
348 KB
Safety Data Sheets (SDS) 3
Permabond ES579 - Safety Data Sheet DE.pdf
381 KB
Permabond ES579 - Safety Data Sheet EN.pdf
376 KB
Permabond ES579 - Fiche de Sécurité FR.pdf
380 KB

Frequently asked questions about Permabond ES579

Practical application and design questions — answered by SILITECH.

Single-part heat-cure 1K epoxy — industrial application with heat curing. 1K epoxies are processed directly without mixing and cured in a single heat-cure step.

1K epoxies are processed directly from the container without mixing — no pot life limitation, no mixing errors. Disadvantage: heat curing required (industrial oven, IR lamp, or hot air). 2K epoxies cure at room temperature but require precise mixing and have a limited pot life. 1K is suitable for line production with heat-cure infrastructure, 2K for workshops without an oven.

Heat curing. For exact conditions, refer to the Permabond TDS — typically 30 minutes at 150 °C or equivalent heat input (e.g., 60 min @ 120 °C).

1K heat-cure epoxies bond metals (steel, aluminum, copper), composites (CFK, GFK), ceramics, and selected plastics (with heat resistance). Substrates must tolerate the curing temperature (typically 150 °C).

Permabond ES579 does not have specific industry approvals such as UL94-V0 (see ES578 for the flame-retardant variant). For general industrial applications, the product is approved according to Permabond standards.

At 5 to 25 °C. 1K heat-cure epoxies have limited storage stability — reactivity decreases with higher storage temperature. For long shelf life, store refrigerated. Allow adhesive to warm to room temperature before opening.

From the Permabond 1K epoxy range: Permabond ES579 (single-part heat-cure 1K epoxy); Permabond ES578 (UL94-V0); Permabond ES562 (standard single-part); Permabond ES550 (standard). For UL94-V0 fire protection, see ES578; for high temperature, see ES566/ES569; for IR/hot air curing (without an industrial oven), see ES5691.

Your question not covered?

Our technical team provides personal advice on material selection, processing questions, and individual requirements. Fast and competent.

Submit inquiry Request sample

Product Specifications

Product Information
Manufacturer Permabond Engineering Adhesives Ltd
Brand Permabond
Container 320 ml
Country of origin Italy
UFI (Unique Formula Identifier) E3N0-C0YT-E006-FUJI
Cure speed (oven)
100°C 240 minutes
120°C 60 minutes
150°C 60 minutes
180°C 20 minutes
Performance at Full Cure
Thermal conductivity 0.65 W/(mK)
Dielectric strength 17.7 kV/mm
Physical Properties
Color ivory
Chemical group Epoxy resin
Viscosity (adhesives) High viscosity >5000 mPas
Viscosity mPa.s 60000-80000
Specific Gravity 1,7
Curing values
Maximum gap fill (mm) 2
Mechanical properties
Hardness (Shore D) 80-85
Shear strength ISO 4587 in N/mm²
Steel 27-41
Aluminum 17-31
Zinc 14-27
Thermal Properties
Operating temperature (°C) -40 to +180
Storage Temperature (°C) 2-7
Coefficient of thermal expansion 45 x 10-6 mm/mm/°C (
Uncategorized
Peel strength (ISO4578) 70 N/25mm
TG Value 105°C
Keywords
Keywords
Non-Conductive

Documents and data sheets

Safety Data Sheets (SDS) and Technical Data Sheets (TDS) for download: