Silicones, silicone oils, sprays
Casting and potting resins
Technical Data
Typical values, not a specification. The technical data sheet (TDS) is binding.
Product Information
- Manufacturer
- Permabond Engineering Adhesives Ltd
- Brand
- Permabond
- Container
- 320 ml
- Country of origin
- Italy
- UFI (Unique Formula Identifier)
- 6VX0-20P2-A00M-VRYD
Cure speed (oven)
- 100°C
- 45 minutes
- 120°C
- 20 minutes
- 130° C
- 15 minutes
Physical Properties
- Color
- black
- Viscosity at 20 rpm
- 50000-180000
- Chemical group
- Epoxy resin
- Viscosity (adhesives)
- High viscosity >5000 mPas
Curing values
- Maximum gap fill (mm)
- 2
Mechanical properties
- Hardness (Shore D)
- >70
Shear strength ISO 4587 in N/mm²
- Steel
- 12-14
Thermal Properties
- Operating temperature (°C)
- -40 to +180
- Storage Temperature (°C)
- 2-7
Features
- Cure speed (induction)
- <3 minutes
Product Description
Permabond ES564 is a special 1K epoxy — engineering variant with specific applications.
Engineering special 1K epoxy with Permabond/SILITECH consulting.
Special 1K epoxy for engineering applications — technical data available via SILITECH distribution.
What distinguishes Permabond ES564
What is Permabond ES564 used for?
Processing
Recommended accessories
Important Notes
Which Permabond 1K epoxy for which application?
Permabond ES564 in direct comparison with related products of the ES series.
Permabond ES564 Current Product | Permabond ES550 → | Permabond ES578 → | Permabond ES560 → | |
|---|---|---|---|---|
| Application | Special 1K epoxy (Engineering) | Standard | Flame-retardant | Comparable Engineering |
| Chemistry | One-component epoxy resin | 1K epoxy | 1K epoxy | 1K epoxy |
| Curing | Heat-cure | Heat-cure | Heat-cure | Heat-cure |
Frequently asked questions about Permabond ES564
Practical application and design questions — answered by SILITECH.
Special 1K epoxy for engineering applications — technical advice available from SILITECH. 1K epoxies are processed directly without mixing and cured in a single heat-cure step.
1K epoxies are processed directly from the container without mixing — no pot life limitation, no mixing errors. Disadvantage: heat curing required (industrial oven, IR lamp, or hot air). 2K epoxies cure at room temperature but require precise mixing and have a limited pot life. 1K is suitable for line production with heat-cure infrastructure, 2K for workshops without an oven.
Heat curing. For exact conditions, refer to the Permabond TDS — typically 30 minutes at 150 °C or equivalent heat input (e.g., 60 min @ 120 °C).
1K heat-cure epoxies bond metals (steel, aluminum, copper), composites (CFK, GFK), ceramics, and selected plastics (with heat resistance). Substrates must tolerate the curing temperature (typically 150 °C).
Permabond ES564 does not have specific industry approvals such as UL94-V0 (see ES578 for the flame-retardant variant). For general industrial applications, the product is approved according to Permabond standards.
At 5 to 25 °C. 1K heat-cure epoxies have limited storage stability — reactivity decreases with higher storage temperature. For long shelf life, store refrigerated. Allow adhesive to warm to room temperature before opening.
From the Permabond 1K epoxy range: Permabond ES564 (Special 1K epoxy (Engineering)); Permabond ES550 (Standard 1K); Permabond ES578 (UL94-V0); Permabond ES560 (Engineering). For UL94-V0 fire protection, see ES578; for high temperature, see ES566/ES569; for IR/hot air curing (without an industrial oven), see ES5691.