Silicones, silicone oils, sprays
Casting and potting resins
Internal reference:
49-566.KT.ML320
HS code:
3506.9190000
Technical Data
Typical values, not a specification. The technical data sheet (TDS) is binding.
Product Information
- Manufacturer
- Permabond Engineering Adhesives Ltd
- Brand
- Permabond
- Container
- 320 ml
- Country of origin
- Italy
- UFI (Unique Formula Identifier)
- 0UM0-0UWM-G00Q-FTSU
Cure speed (oven)
- 90°C
- 75 minutes
- 100°C
- 40 minutes
- 120°C
- 25 minutes
- 150°C
- 10 minutes
Physical Properties
- Color
- grau
- Chemical group
- Epoxy resin
- Viscosity (adhesives)
- High viscosity >5000 mPas
- Viscosity 2rpm
- 150000-300000
- Viscosity at 20 rpm
- 60000-120000
- Specific Gravity
- 1.3
Curing values
- Maximum gap fill (mm)
- 2
Mechanical properties
- Hardness (Shore D)
- >70
Thermal Properties
- Operating temperature (°C)
- -40 to +180
- Storage Temperature (°C)
- 2-7
- Coefficient of thermal expansion
- 45 x 10⁻⁶ mm/mm/°C
Features
- Cure speed (induction)
- <3 minutes
Product Description
Permabond ES566 is a high-temperature resistant 1K epoxy heat-cure adhesive with extended temperature reserve for demanding industrial applications.
High-temperature 1K epoxy for applications with continuous temperatures where standard adhesives would lose strength.
High-temperature resistant 1K epoxy — designed for applications with elevated continuous temperatures, retains strength significantly longer than standard 1K epoxies.
What distinguishes Permabond ES566
What is Permabond ES566 used for?
Processing
Recommended accessories
Important Notes
Which Permabond 1K epoxy for which application?
Permabond ES566 in direct comparison with related products of the ES series.
Permabond ES566 Current Product | Permabond ES569 → | Permabond ES578 → | Permabond ES550 → | |
|---|---|---|---|---|
| Application | High-temperature 1K epoxy — Heat-cure with temperature reserve | Comparable | With UL94-V0 | Standard without high temperature |
| Chemistry | One-component epoxy resin (heat-cure, high-temperature) | 1K epoxy | 1K epoxy | 1K epoxy |
| Curing | Heat curing | Heat-cure | Heat-cure | Heat-cure |
Frequently asked questions about Permabond ES566
Practical application and design questions — answered by SILITECH.
High-temperature resistant 1K epoxy — heat curing with extended temperature reserve. 1K epoxies are processed directly without mixing and cured in a single heat-cure step.
1K epoxies are processed directly from the container without mixing — no pot life limitation, no mixing errors. Disadvantage: heat curing required (industrial oven, IR lamp, or hot air). 2K epoxies cure at room temperature but require precise mixing and have a limited pot life. 1K is suitable for line production with heat-cure infrastructure, 2K for workshops without an oven.
Heat curing. For exact conditions, refer to the Permabond TDS — typically 30 minutes at 150 °C or equivalent heat input (e.g., 60 min @ 120 °C).
1K heat-cure epoxies bond metals (steel, aluminum, copper), composites (CFK, GFK), ceramics, and selected plastics (with heat resistance). Substrates must tolerate the curing temperature (typically 150 °C).
Permabond ES566 does not have specific industry approvals such as UL94-V0 (see ES578 for the flame-retardant variant). For general industrial applications, the product is approved according to Permabond standards.
At 5 to 25 °C. 1K heat-cure epoxies have limited storage stability — reactivity decreases with higher storage temperature. For long shelf life, store refrigerated. Allow adhesive to warm to room temperature before opening.
From the Permabond 1K epoxy series: Permabond ES566 (high-temperature 1K epoxy — heat-cure with temperature reserve); Permabond ES569 (high-temperature 1K); Permabond ES578 (UL94-V0 high-temperature); Permabond ES550 (standard 1K). For UL94-V0 fire protection, see ES578; for high temperature, see ES566/ES569; for IR/hot air curing (without an industrial oven), see ES5691.