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PERMABOND ES5744

PERMABOND ES5744

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Special 1K epoxy (Engineering) — on request

Special 1K epoxy ES5744 — Engineering applications with SILITECH consultation.

Price on request

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General Terms and Conditions

Shipping usually within 1 to 3 business days
(Availability confirmed after order)

Express logistics. Fast and reliable within Switzerland & Europe

From Swiss stock Dispatch within 24h Batch certificate Invoice 30 days (B2B) Technical advice
Shipping & Delivery

Usually 1 to 3 business days

Availability is confirmed after order receipt.

Express logistics within Switzerland & Europe.

Terms and Conditions →

Product data

Internal reference: 49-5744.KT.ML320

Internal reference: 49-5744.KT.ML320

PERMABOND ES5744
PERMABOND ES5744
Permabond · SKU 49-5744.KT.ML320

Permabond ES5744 is a special 1K epoxy with an engineering profile.

Engineering 1K epoxy for specific applications.

PRODUCT NOTE

Special 1K epoxy ES5744 for engineering applications — technical data available via SILITECH sales.

Permabond ES5744 in figures
1K
Single-part
Engineering
Special
Heat-cure
Heat curing
Consulting
SILITECH

What sets Permabond ES5744 apart

1K System
No mixing.
Engineering Special
Specific.
Heat-cure
Heat curing.
SILITECH consultation
Via sales.
Solvent-free
100% reactive.
Original Permabond
Manufacturer original.

What is Permabond ES5744 used for?

Engineering applications
Special requirements.
Industrial special solutions
With consultation.
R&D area
Test applications.
Custom bonding
Application-specific.
Industry Premium
With consultation.

Processing

1
Clean surfaces
Prepare bonding surfaces clean, dry, and free of grease — degrease with Permabond Cleaner A. Lightly sand aluminum and copper to remove the oxide layer.
2
Apply adhesive directly
Apply Permabond ES5744 directly from the container without mixing — as a 1K system, there is no pot life limitation. Avoid air entrapment.
3
Joining and fixing components
Join components with sufficient pressure. Use a clamping device or clamp to prevent the parts from moving during curing.
4
Perform heat curing
Curing occurs through heat application — heat curing. Typical conditions: 30 minutes at 150 °C in an industrial oven or with equivalent IR/hot air curing. See TDS for exact values.
5
Final strength after cooling
After heat curing, allow the component to cool down — full strength is achieved immediately after cooling. Unlike 2K epoxies at room temperature, there is no 24-hour waiting period.
Data Sheets & Safety Data Sheet
Complete TDS and SDS in DE, EN, FR — view or download directly.
To the documents →

Recommended accessories

Permabond Cleaner A Aerosol
Spray cleaner for quick preparation of bonding surfaces before applying the 1K heat-cure epoxy.
To the product →
Permabond ES578 — UL94-V0
Flame-retardant 1K epoxy per Underwriter's Laboratory standard — for safety-critical industrial applications.
To the product →
Permabond ES566 — High Temperature
High-temperature resistant 1K epoxy for demanding thermal applications.
To the product →
Permabond ES5691 — IR/Hot Air
1K epoxy with IR lamp or hot air curing — flexible without an industrial oven.
To the product →

Important Notes

Important Notes
Clarify with SILITECH sales before ordering.
Storage
Store at 5 to 25 °C. 1K heat-cure epoxies have limited storage stability — reactivity decreases with higher storage temperature. Observe the expiration date.

Which Permabond 1K epoxy for which application?

Permabond ES5744 in direct comparison with related products from the ES series.

Permabond ES5744
Current Product		Permabond ES574.5 →Permabond ES560 →Permabond ES578 →
ApplicationSpecial 1K epoxy (Engineering)ComparableComparableFlame-retardant
ChemistryOne-component epoxy resin1K epoxy1K epoxy1K epoxy
CuringHeat-cureHeat-cureHeat-cureHeat-cure
Topics & Application Fields
Key terms related to this product. Also useful for our search and filters.
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Technical data for PERMABOND ES5744

Product Information
Brand Permabond
Container 320 ml

Please refer to the technical data sheet (TDS) in the "Documents" tab for binding values.

No public documents available.
On request, we will gladly send you TDS and SDS by email, Submit request.

Frequently Asked Questions about Permabond ES5744

Practical application and design questions — answered by SILITECH.

Special 1K epoxy ES5744 for engineering applications. 1K epoxies are processed directly without mixing and cured in a heat-cure step.

1K epoxies are processed directly from the container without mixing — no pot life limitation, no mixing errors. Disadvantage: heat curing required (industrial oven, IR lamp, or hot air). 2K epoxies cure at room temperature but require precise mixing and have a limited pot life. 1K is suitable for line production with heat-cure infrastructure, 2K for workshops without an oven.

Heat curing. For exact conditions, refer to the Permabond TDS — typically 30 minutes at 150 °C or equivalent heat input (e.g., 60 min @ 120 °C).

1K heat-cure epoxies bond metals (steel, aluminum, copper), composites (CFK, GFK), ceramics, and selected plastics (with heat resistance). Substrates must tolerate the curing temperature (typically 150 °C).

Permabond ES5744 has no specific industry approvals such as UL94-V0 (see ES578 for the flame-retardant variant). For general industrial applications, the product is released according to Permabond standards.

At 5 to 25 °C. 1K heat-cure epoxies have limited storage stability — reactivity decreases with higher storage temperature. For long shelf life, store refrigerated. Allow adhesive to warm to room temperature before opening.

From the Permabond 1K epoxy series: Permabond ES5744 (Special 1K epoxy (Engineering)); Permabond ES574.5 (Engineering); Permabond ES560 (Engineering); Permabond ES578 (UL94-V0). For UL94-V0 fire protection, see ES578; for high temperature, ES566/ES569; for IR/hot air curing (without industrial oven), ES5691.

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Product Specifications

Brand Permabond
Container 320 ml
Keywords
Keywords
PERMABOND Range Review 2026 Price list missing