PERMABOND ES574.5
Special 1K epoxy (Engineering) — on request
Special 1K epoxy ES574.5 — Engineering applications with SILITECH consulting.
Internal reference:
49-574.5.KT.ML320
Permabond ES574.5 is a special 1K epoxy for engineering applications.
Engineering variant with special profile.
Special 1K epoxy ES574.5 for engineering applications — technical data available via SILITECH distribution.
What distinguishes Permabond ES574.5
What is Permabond ES574.5 used for?
Processing
Recommended accessories
Important Notes
Which Permabond 1K epoxy for which application?
Permabond ES574.5 in direct comparison with related products of the ES series.
Permabond ES574.5 Current Product | Permabond ES5744 → | Permabond ES560 → | Permabond ES578 → | |
|---|---|---|---|---|
| Application | Special 1K epoxy (Engineering) | Comparable | Comparable | Flame-retardant |
| Chemistry | One-component epoxy resin | 1K epoxy | 1K epoxy | 1K epoxy |
| Curing | Heat-cure | Heat-cure | Heat-cure | Heat-cure |
Technical data for PERMABOND ES574.5
| Product Information | |
|---|---|
| Brand | Permabond |
| Container | 320 ml |
Please refer to the technical data sheet (TDS) in the "Documents" tab for binding values.
No public documents available.
On request, we will gladly send you TDS and SDS by email, Submit request.
Frequently asked questions about Permabond ES574.5
Practical application and design questions — answered by SILITECH.
Special 1K epoxy ES574.5 for engineering applications. 1K epoxies are processed directly without mixing and cured in a single heat-cure step.
1K epoxies are processed directly from the container without mixing — no pot life limitation, no mixing errors. Disadvantage: heat curing required (industrial oven, IR lamp, or hot air). 2K epoxies cure at room temperature but require precise mixing and have a limited pot life. 1K is suitable for line production with heat-cure infrastructure, 2K for workshops without an oven.
Heat curing. For exact conditions, refer to the Permabond TDS — typically 30 minutes at 150 °C or equivalent heat input (e.g., 60 min @ 120 °C).
1K heat-cure epoxies bond metals (steel, aluminum, copper), composites (CFK, GFK), ceramics, and selected plastics (with heat resistance). Substrates must tolerate the curing temperature (typically 150 °C).
Permabond ES574.5 does not have specific industry approvals such as UL94-V0 (see ES578 for the flame-retardant variant). For general industrial applications, the product is approved according to Permabond standards.
At 5 to 25 °C. 1K heat-cure epoxies have limited storage stability — reactivity decreases with higher storage temperature. For long shelf life, store refrigerated. Allow adhesive to warm to room temperature before opening.
From the Permabond 1K epoxy range: Permabond ES574.5 (Special 1K epoxy (Engineering)); Permabond ES5744 (Engineering); Permabond ES560 (Engineering); Permabond ES578 (UL94-V0). For UL94-V0 fire protection, see ES578; for high temperature, see ES566/ES569; for IR/hot air curing (without an industrial oven), see ES5691.
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Product Specifications
| Brand | Permabond |
| Container | 320 ml |
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