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PERMABOND ES569

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Permabond ES569 — Epoxy structural adhesive, viscosity 250000-500000 mPa·s, Shore D 80-85.

High-temperature resistant 1K epoxy — industrial premium with heat stress resistance.

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  • brand
  • Container
  • Color
  • Country of origin
  • Chemical group
  • Viscosity (adhesives)
  • Viscosity mPa·s
  • Operating temperature (°C)
  • Hardness (Shore D)
  • Storage temperature (°C)
  • Maximum gap width (mm)
  • Thermal conductivity
  • 130°C
  • 150°C
  • 170°C
  • Curing speed (induction)
  • Steel
  • aluminum
  • zinc
  • FRP glass/epoxy
  • CFRP
  • Peel resistance (ISO 4578)
  • Specific gravity
  • UFI (Unique Formula Identifier)
  • TG value

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Metal ceramic ferrites

 
General Terms and Conditions.

Shipping usually within 1 to 3 business days
(availability will be confirmed after ordering)

. Express logistics. Fast and reliable within Switzerland & Europe.

Shipping from Swiss warehouse within 24 hours. Batch certificate. Invoice within 30 days (B2B). Technical support.
Shipping & Delivery

Usually 1 to 3 working days

Availability will be confirmed after order receipt.

Express logistics within Switzerland & Europe.

General Terms and Conditions →

Product data

Internal reference: 49-569.KT.G320

HS code: 3506.9190000

Internal reference: 49-569.KT.G320
HS code: 3506.9190000

PERMABOND ES569
PERMABOND ES569
Permabond · Permabond Engineering Adhesives Ltd · SKU 49-569.KT.G320

Permabond ES569 is a high-temperature resistant 1K epoxy — an industry-standard heat-cure for demanding heat applications.

High-temperature 1K epoxy for industrial bonding applications under heat stress.

APPLICATION PROFILE

High-temperature resistant 1K epoxy — industrial application with heat curing and extended temperature reserve.

Permabond ES569 in figures
High temperature
Resistant
1K
Single-part
Heat Cure
Heat curing
industry
Premium

What distinguishes Permabond ES569

High temperature resistant
Extended Reserve.
1K system
Do not mix.
Heat Cure
Heat curing.
Industry Premium
High-temperature applications.
Solvent-free
100% reactive.
Multi-substrate
Different substrates.

What is Permabond ES569 used for?

High-temperature industrial bonding
Machines, pumps, motors.
Components subject to continuous thermal load
Industrial furnaces, heating equipment.
Composite bonding high temp
CFRP/GFRP with heat.
Multi-material
Different substrates.
Premium industrial adhesive
Demanding applications.

processing

1
Clean surfaces
Prepare bonding surfaces to be clean, dry, and free of grease — degrease with Permabond Cleaner A. Lightly sand aluminum and copper to remove oxide layers.
2
Apply adhesive directly
Apply Permabond ES569 directly from the container without mixing — as a 1K system, there is no pot life limitation. Avoid air bubbles.
3
Add and fix components
Assemble the components with sufficient pressure. Use a clamping device or vise to prevent the parts from moving during curing.
4
Perform heat curing
Curing is achieved through heat application — heat curing. Typical conditions: 30 minutes at 150 °C in an industrial oven or equivalent IR/hot air curing. See TDS for exact values.
5
Final strength after cooling
After heat curing, allow the component to cool down – final strength is reached immediately after cooling. Unlike with 2-component epoxies at room temperature, there is no 24-hour waiting time.
Data sheets & safety data sheet
Full TDS and SDS in DE, EN, FR — view or download directly.
To the documents →

Recommended accessories

Permabond Cleaner A Aerosol
Spray cleaner for the quick preparation of bonding surfaces before applying the 1K heat-cure epoxy.
View product →
Permabond ES578 — UL94-V0
Flame-retardant 1K epoxy to Underwriter's Laboratory standard — for safety-critical industrial applications.
View product →
Permabond ES566 — High temperature
High-temperature resistant 1K epoxy for demanding heat applications.
View product →
Permabond ES5691 — IR/hot air
1K epoxy with IR lamp or hot air curing — flexible without an industrial oven.
View product →

Important instructions

Important instructions
Heat curing is required.
storage
Store between 5 and 25 °C. 1K heat-cure epoxides have limited storage stability—reactivity decreases with increasing storage temperature. Observe the expiration date.

Which Permabond 1K epoxy is suitable for which application?

Permabond ES569 in direct comparison with related products of the ES series.

Permabond ES569
Current product		Permabond ES566 →Permabond ES578 →Permabond ES5691 →
ApplicationHigh-temperature 1K epoxy — Heat-cureComparableWith UL94-V0Variant with IR curing
ChemistryOne-component epoxy resin (heat-cure, high-temperature)1K epoxy1K epoxy1K epoxy
CuringHeat curingHeat CureHeat CureHeat Cure
Topics & Application Areas
Key terms related to this product. Also useful for our search and filters.
Metal ceramic ferrites

Technical data for PERMABOND ES569

All 26 product information 5 Curing speed (oven) 3 Performance at final strength 1 Properties of the final bond 1 Physical properties 5 Curing values ​​1 Mechanical properties 1 Shear strength ISO 4587 in N/mm² 5 Thermal properties 2 General 2
Product information
Manufacturer Permabond Engineering Adhesives Ltd
brand Permabond
Container 320 ml
Country of origin Italy
UFI (Unique Formula Identifier) UH60-D0X3-1000-XWFU
Curing speed (oven)
130°C 75 minutes
150°C 60 minutes
170°C 40 minutes
Performance at final strength
Thermal conductivity 0.5 W/(mK)
Properties of the permanent bond
Peel resistance (ISO 4578) 100-120 N/25mm
Physical properties
Color black
Chemical group epoxy resin
Viscosity (adhesives) High viscosity >5000 mPas
Viscosity mPa·s 250000-500000
Specific gravity 1.2
Curing values
Maximum gap width (mm) 5
Mechanical properties
Hardness (Shore D) 80-85
Shear strength ISO 4587 in N/mm²
Steel 27-41
aluminum 17-31
zinc 14-27
FRP glass/epoxy 9-11
CFRP 10-12
Thermal properties
Operating temperature (°C) -40 to +180
Storage temperature (°C) 2-7
Generally
Curing speed (induction) <3 minutes
TG value 130°C

For binding values, please refer to the technical data sheet (TDS) in the "Documents" tab.

Documents and datasheets

Click on a document for a preview or the download icon for a direct download.

Technical Data Sheets (TDS) 6
Permabond ES569 - Technical Data Sheet DE.pdf
384 KB
Permabond ES569 - Technical Data Sheet DE.pdf
384 KB
Permabond ES569 - Technical Data Sheet EN.pdf
524 KB
Permabond ES569 - Technical Data Sheet EN.pdf
374 KB
Permabond ES569 - Fiche Technique FR.pdf
348 KB
Permabond ES569 - Fiche Technique FR.pdf
348 KB
Safety Data Sheets (SDS) 3
Permabond ES569 - Safety Data Sheet DE.pdf
402 KB
Permabond ES569 - Safety Data Sheet EN.pdf
380 KB
Permabond ES569 - Fiche de Sécurité FR.pdf
401 KB

Frequently asked questions about Permabond ES569

Practical application and design questions — answered by SILITECH.

High-temperature resistant 1K epoxy — industrial application with heat curing. 1K epoxies are processed directly without mixing and cured in a single heat-cure step.

One-component (1K) epoxies are processed directly from the container without mixing—no pot life limitations, no mixing errors. Disadvantage: Heat curing is required (industrial oven, IR lamp, or hot air). Two-component (2K) epoxies cure at room temperature but require precise mixing and have a limited pot life. One-component (1K) epoxies are suitable for line production with heat-curing infrastructure, while two-component (2K) epoxies are suitable for workshops without an oven.

Heat curing. For exact conditions, see Permabond-TDS — typically 30 minutes at 150 °C or equivalent heat input (e.g. 60 min @ 120 °C).

One-component heat-cure epoxies bond metals (steel, aluminum, copper), composites (CFRP, GFRP), ceramics, and selected heat-resistant plastics. Substrates must tolerate the curing temperature (typically 150 °C).

Permabond ES569 does not have specific industry approvals such as UL94-V0 (see ES578 for the flame-retardant variant). For general industrial applications, the product is approved according to Permabond standards.

Store between 5 and 25 °C. 1K heat-cure epoxies have limited storage stability—reactivity decreases with increasing storage temperature. For long shelf life, store refrigerated. Allow the adhesive to warm to room temperature before opening.

From the Permabond 1K epoxy series: Permabond ES569 (high-temperature 1K epoxy — heat-cure); Permabond ES566 (high-temperature 1K); Permabond ES578 (UL94-V0); Permabond ES5691 (1K variant). For UL94-V0 fire protection, see ES578; for high temperature, see ES566/ES569; for IR/hot air curing (without an industrial oven), see ES5691.

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Product specifications

Product information
Manufacturer Permabond Engineering Adhesives Ltd
brand Permabond
Container 320 ml
Country of origin Italy
UFI (Unique Formula Identifier) UH60-D0X3-1000-XWFU
Curing speed (oven)
130°C 75 minutes
150°C 60 minutes
170°C 40 minutes
Performance at final strength
Thermal conductivity 0.5 W/(mK)
Properties of the permanent bond
Peel resistance (ISO 4578) 100-120 N/25mm
Physical properties
Color black
Chemical group epoxy resin
Viscosity (adhesives) High viscosity >5000 mPas
Viscosity mPa·s 250000-500000
Specific gravity 1.2
Curing values
Maximum gap width (mm) 5
Mechanical properties
Hardness (Shore D) 80-85
Shear strength ISO 4587 in N/mm²
Steel 27-41
aluminum 17-31
zinc 14-27
FRP glass/epoxy 9-11
CFRP 10-12
Thermal properties
Operating temperature (°C) -40 to +180
Storage temperature (°C) 2-7
Uncategorized
Curing speed (induction) <3 minutes
TG value 130°C
Keywords
Keywords
Metal ceramic ferrites

Documents and datasheets

Safety Data Sheets (SDS) and Technical Data Sheets (TDS) are available for download: