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Exothermic reactions during epoxy potting: Risks with large volumes

Exothermic reactions during epoxy potting: Risks with large volumes. Epoxy resins cure by releasing heat. In thin layers, this is harmless – in large potting volumes, the heat can build up and...

Industry: Electronics & Printed Circuit Boards Property: Chemical Resistant Brand: Elkem Type: Guide World: Processing & Dispensing Technology World: Potting & Electronic Protection

16.06.2026

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Cracks in the potting compound: causes and material selection

Cracks in the potting compound: Causes and material selection. A cracked potting compound loses its protective function – moisture and other substances penetrate, and the mechanical support is lost. Cracks almost always have a cause...

Industry: Electronics & Printed Circuit Boards Property: Temperature Resistant Brand: Elkem Brand: SILISIL Type: Guide World: Processing & Dispensing Technology World: Potting & Electronic Protection

16.06.2026

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Avoid potting defects: bubbles, delamination, shrinkage, pot life

Bubbles, delamination, shrinkage, sticky surface: the most common potting defects – their causes and how to avoid them.

World: Casting & Electronics Protection

14.06.2026

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Potting electronics: Step-by-step instructions

From material to curing: How to pot electronics step by step – with tips against bubbles and incomplete curing.

World: Casting & Electronics Protection

14.06.2026

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Thermally conductive potting compounds: λ-values explained | SILITECH

Even the best heatsink is useless when power electronics overheat – unless the heat can escape from the encapsulated component. Thermally conductive potting compounds with a high λ-value do exactly that: They protect electronics from environmental influences while simultaneously dissipating waste heat.

Industry: Electronics & Printed Circuit Boards Property: Thermally Conductive Type: Guide World: Potting & Electronic Protection

24.02.2026

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