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Permabond Engineering Adhesives LtdEpoxy Adhesives (1-K & 2-K)

PERMABOND ET 5411

High-temperature 2K epoxy 2:1 — low viscosity for structural bonding under heat stress.

Chemical Group (A)
Epoxy resin
Color (A)
White
Specific gravity (A)
1.4
Chemical Group (B)
Anhydride hardener

CHF 0.00 / pc.
  • Manufacturer
  • Brand
  • Container
  • Chemical Group (A)
  • Color (A)
  • Viscosity 20rpm (A)
  • Viscosity 2rpm (A)
  • Specific gravity (A)
  • Chemical Group (B)
  • Color (B)
  • Viscosity 20rpm (B)
  • Viscosity 2rpm (B)
  • Specific Gravity (B)
  • Country of origin
  • Operating temperature (°C)
  • Mixing Ratio
  • Color
  • Viscosity (adhesives)
  • Hardness (Shore D)
  • Storage Temperature (°C)
  • Maximum gap fill (mm)
  • Steel
  • Pot Life at 23°C
  • Final strength at 130°C
  • UFI Part A
  • UFI Part B
  • Elongation at break (elasticity) (DIN53504)
Your selection PERMABOND ET 5411
General terms and conditions of business

HS Code: 3506.9190000

PERMABOND ET 5411 sample offer

Technical Data

Typical values, not a specification. The technical data sheet (TDS) is binding.

Product Information

Manufacturer
Permabond Engineering Adhesives Ltd
Brand
Permabond
Container
50 ml, 400 ml
Country of origin
Italy
Mixing Ratio
2:1

Physical Properties A

Chemical Group (A)
Epoxy resin
Color (A)
White
Viscosity 20rpm (A)
40000-60000
Viscosity 2rpm (A)
100000-200000
Specific gravity (A)
1.4
UFI Part A
6690-30AD-H00C-FGHU

Physical Properties B

Chemical Group (B)
Anhydride hardener
Color (B)
Black
Viscosity 20rpm (B)
10000-15000
Viscosity 2rpm (B)
50000-80000
Specific Gravity (B)
1.2
UFI Part B
2990-M00S-T003-3U3W

Performance at Full Cure

Elongation at break (elasticity) (DIN53504)
<2%

Physical Properties

Color
grau
Viscosity (adhesives)
Thixotropic

Curing values

Maximum gap fill (mm)
2
Pot Life at 23°C
16 hours

Mechanical properties

Hardness (Shore D)
88

Shear strength ISO 4587 in N/mm²

Steel
21 N/mm²

Thermal Properties

Operating temperature (°C)
-40 to +230 (peak +300)
Storage Temperature (°C)
5-25

Features

Final strength at 130°C
2 hours
Keywords
  • High temperature resistance
  • Chemical Resistance

Product Description

Permabond ET5411 is a high-temperature resistant 2K epoxy in a 2:1 ratio — low viscosity for tightly toleranced structural bonding under thermal stress.

ET5411 was specifically developed for applications with elevated continuous temperatures — where standard epoxies would lose strength, ET5411 remains resilient. Its low viscosity allows it to penetrate tight-tolerance adhesive gaps.

HIGH-TEMPERATURE EPOXY

High-temperature, low-viscosity, two-component epoxy – designed for structural bonding under heat stress and with tightly toleranced gaps. Retains strength at elevated continuous temperatures.

Permabond ET 5411 in figures
High temperature
Heat resistant
2:1
Mixing
Low viscosity
Tightly tolerated adhesive bonds
Structural adhesive
Industrial grade

What distinguishes Permabond ET 5411

High temperature resistance
Retains strength at elevated continuous temperatures.
Low viscosity
For tightly toleranced structural bonding.
2:1 mixing ratio
Standard dual cartridge.
Structural adhesive
High-strength industrial adhesive.
Full cure at room temperature
Optional heat curing.
Solvent-free
100% reactive.

What is Permabond ET 5411 used for?

High-temperature structural bonding
Components with continuous operating temperatures.
Engine and drive system construction
Hot components.
Industrial furnace components
When standard epoxides lose strength.
Tightly tolerated structural bonding
Low viscosity for micro-gap applications.
Composite applications with heat
CFRP/GFRP structures under thermal load.

Processing

1
Clean surfaces
Bonding surfaces must be clean, dry, and free of grease. Degrease with Permabond Cleaner A or a solvent (acetone, isopropanol). Lightly sand aluminum and copper to remove oxide layers.
2
Mix components A + B
For twin cartridges: attach the mixing nozzle and press evenly (2:1 volume ratio mixing ratio). For larger containers: weigh resin and hardener in the correct ratio and mix thoroughly until no streaks are visible. Avoid air entrapment.
3
Apply adhesive + join components
Apply the mixed adhesive to one bonding surface within the pot life (—). Join the components with sufficient pressure to distribute the adhesive over the entire bonding surface.
4
Fix components during curing
Use a clamping device or clamp to ensure the components do not move during curing. Wait for handling strength and functional strength according to the TDS.
5
Full cure at room temperature
Final strength is typically achieved after 24 hours at 23 °C. Increasing the temperature by 8 °C halves the curing time; lower temperatures slow down the process. If necessary, optionally post-cure at 60–80 °C for maximum strength.
Data Sheets & Safety Data Sheet
Complete TDS and SDS in DE, EN, FR — view or download directly.
To the documents →

Recommended accessories


Important Notes

Important Notes
Before bonding, degrease and, if necessary, sand the surfaces. Heat curing can further increase strength.
Storage
Store at 5 to 25 °C. Keep 2K epoxy components in closed packaging — especially protect the hardener from moisture.

Which Permabond 2K epoxy for which application?

Permabond ET 5411 in direct comparison with related products of the ET series.

Permabond ET 5411
Current Product
Permabond ET5441 →Permabond ET5401 →Permabond ET540 →
Application / PropertyHigh-temperature 2K epoxy 2:1 — low viscosity, heat resistantThermally conductive, flame-retardantFaster curingVery long pot life
Mixing ratio2:1 by volume2:12:12:1
Pot life——10–12 min120–150 min
Steel shear strength—20–25 N/mm²20–30 N/mm²22–26 N/mm²
Carbon fiber—25–30 N/mm²22–24 N/mm²—

Frequently asked questions about Permabond ET 5411

Practical application and design questions — answered by SILITECH.

High-temperature 2-component epoxy 2:1 — low viscosity for tightly toleranced structural bonding under heat stress. The 2-component epoxy is mixed in a 2:1 volume ratio and offers a pot life of —.

Mix both components in a 2:1 ratio by volume — using the mixing nozzle for dual cartridges, weigh precisely for larger containers. Apply within the pot life (—) and join components. Full curing typically occurs after — at room temperature.

The pot life of Permabond ET 5411 is typically — at 23 °C. Higher temperatures shorten, lower temperatures lengthen the pot life. Mixtures above approximately 100 g may gel more quickly due to an exothermic reaction.

Permabond ET 5411 typically bonds metals, composites, and plastics. For substrate-specific values, see TDS.

Permabond ET 5411 does not have specific industry-specific approvals such as EU 10/2011 (food), UL94 (fire protection), or Boeing/Airbus (aerospace). For general industrial applications, the product is approved according to Permabond standards.

Permabond ET 5411 is a high-temperature, two-component epoxy resin (2:1 volume mix, pot life) — low viscosity, heat Permabond ET 5441 is thermally conductive UL94 (2:1 volume mix, pot life) — thermally conductive, flame-retardant.

From the Permabond 2K epoxy range, select according to application, mixing ratio, and strength requirements: Permabond ET 5411 (High-temperature 2K epoxy 2:1 — low viscosity, heat-resistant); Permabond ET 5441 (Thermally conductive UL94); Permabond ET 5401 (Fast 2:1); Permabond ET 540 (Long pot life). For aerospace applications, see ET 515 (Aircraft Seat Trays); for food applications, see ET 5162 (EU 10/2011 + FDA); for thermal conductivity/fire protection, see ET 5441 (UL94-V0).