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  2. Adhesives & Sealants
  3. Epoxy adhesives (1-component & 2-component)
  4. PERMABOND ES568
  5. Epoxy adhesives (1-component & 2-component)
Price list: Website 0 CHF Price list
Price list: Website 0 CHF Price list

Permabond Engineering Adhesives LtdEpoxy Adhesives (1-K & 2-K)

PERMABOND ES568

Special 1K epoxy ES568 — Engineering applications with SILITECH consulting.

Chemical group
Epoxy resin
Color
black
Viscosity (adhesives)
High viscosity >5000 mPas
Viscosity mPa.s
40000-60000

CHF 0.00 / ml
  • Manufacturer
  • Brand
  • Container
  • Color
  • Country of origin
  • Chemical group
  • Viscosity (adhesives)
  • Viscosity mPa.s
  • Operating temperature (°C)
  • Hardness (Shore D)
  • Storage Temperature (°C)
  • Maximum gap fill (mm)
  • 135°C
  • 150°C
  • 160
  • Steel
Your selection PERMABOND ES568 49-568.KT.ML320
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Technical documentation

Technical data sheets

Safety data sheets

Further documents

Internal reference: 49-568.KT.ML320
HS code: 3506.9190000

PERMABOND ES568 Sample Offer

Technical Data

Typical values, not a specification. The technical data sheet (TDS) is binding.

Product Information

Manufacturer
Permabond Engineering Adhesives Ltd
Brand
Permabond
Container
320 ml
Country of origin
Italy

Cure speed (oven)

135°C
35 minutes
150°C
20 minutes

Physical Properties

Color
black
Chemical group
Epoxy resin
Viscosity (adhesives)
High viscosity >5000 mPas
Viscosity mPa.s
40000-60000

Curing values

Maximum gap fill (mm)
0,5

Mechanical properties

Hardness (Shore D)
84

Shear strength ISO 4587 in N/mm²

Steel
30-35

Thermal Properties

Operating temperature (°C)
-40 to +180
Storage Temperature (°C)
2-7

Features

160
15 minutes
Keywords
  • Metal
  • Ceramic
  • Ferrites

Product Description

Permabond ES568 is a special 1K epoxy for engineering applications.

Engineering variant with special profile.

PRODUCT NOTE

Special 1K epoxy for engineering applications

Permabond ES568 in figures
1K
Single-part
Engineering
Special
Heat-cure
Heat curing
Consulting
SILITECH

What distinguishes Permabond ES568

1K System
No mixing.
Engineering Special
Specific.
Heat-cure
Heat curing.
SILITECH consultation
Via sales.
Solvent-free
100% reactive.
Original Permabond
Manufacturer original.

What is Permabond ES568 used for?

Engineering applications
Special requirements.
Industrial special solutions
With consultation.
R&D area
Test applications.
Custom bonding
Application-specific.
Industry Premium
With consultation.

Processing

1
Clean surfaces
Prepare bonding surfaces clean, dry, and free of grease — degrease with Permabond Cleaner A. Lightly sand aluminum and copper to remove the oxide layer.
2
Apply adhesive directly
Apply Permabond ES568 directly from the container without mixing — as a 1K system, there is no pot life limitation. Avoid air bubbles.
3
Join and fix components
Join components with sufficient pressure. Use a clamping device or clamp to prevent the parts from moving during curing.
4
Perform heat curing
Curing occurs through heat application — heat curing. Typical conditions: 30 minutes at 150 °C in an industrial oven or with equivalent IR/hot air curing. See TDS for exact values.
5
Final strength after cooling
After heat curing, allow the component to cool down — full strength is achieved immediately after cooling. Unlike 2K epoxies at room temperature, there is no 24-hour waiting period.
Data Sheets & Safety Data Sheet
Complete TDS and SDS in DE, EN, FR — view or download directly.
To the documents →

Recommended accessories

Permabond Cleaner A Aerosol
Spray cleaner for quick preparation of bonding surfaces before applying the 1K heat-cure epoxy.
To the product →
Permabond ES578 — UL94-V0
Flame-retardant 1K epoxy per Underwriter's Laboratory standard — for safety-critical industrial applications.
To the product →
Permabond ES566 — High Temperature
High-temperature resistant 1K epoxy for demanding thermal applications.
To the product →
Permabond ES5691 — IR/Hot Air
1K epoxy with IR lamp or hot air curing — flexible without an industrial oven.
To the product →

Important Notes

Important Notes
Clarify with SILITECH sales before ordering.
Storage
Store at 5 to 25 °C. 1K heat-cure epoxies have limited storage stability — reactivity decreases with higher storage temperature. Observe the expiration date.

Which Permabond 1K epoxy for which application?

Permabond ES568 in direct comparison with related products of the ES series.

Permabond ES568
Current Product		Permabond ES560 →Permabond ES564 →Permabond ES578 →
ApplicationSpecial 1K epoxy (Engineering)ComparableComparableFlame-retardant
ChemistryOne-component epoxy resin1K epoxy1K epoxy1K epoxy
CuringHeat-cureHeat-cureHeat-cureHeat-cure

Frequently asked questions about Permabond ES568

Practical application and design questions — answered by SILITECH.

Special 1K epoxy for engineering applications. 1K epoxies are processed directly without mixing and cured in a single heat-cure step.

1K epoxies are processed directly from the container without mixing — no pot life limitation, no mixing errors. Disadvantage: heat curing required (industrial oven, IR lamp, or hot air). 2K epoxies cure at room temperature but require precise mixing and have a limited pot life. 1K is suitable for line production with heat-cure infrastructure, 2K for workshops without an oven.

Heat curing. For exact conditions, refer to the Permabond TDS — typically 30 minutes at 150 °C or equivalent heat input (e.g., 60 min @ 120 °C).

1K heat-cure epoxies bond metals (steel, aluminum, copper), composites (CFK, GFK), ceramics, and selected plastics (with heat resistance). Substrates must tolerate the curing temperature (typically 150 °C).

Permabond ES568 does not have specific industry approvals such as UL94-V0 (see ES578 for the flame-retardant version). For general industrial applications, the product is approved according to Permabond standards.

At 5 to 25 °C. 1K heat-cure epoxies have limited storage stability — reactivity decreases with higher storage temperature. For long shelf life, store refrigerated. Allow adhesive to warm to room temperature before opening.

From the Permabond 1K epoxy range: Permabond ES568 (special 1K epoxy (engineering)); Permabond ES560 (engineering); Permabond ES564 (engineering); Permabond ES578 (UL94-V0). For UL94-V0 fire protection, see ES578; for high temperature, see ES566/ES569; for IR/hot air curing (without an industrial oven), see ES5691.