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Permabondepoxy adhesives (1-component & 2-component)

PERMABOND ES5681

Special 1K epoxy ES5681 — Engineering applications with SILITECH consulting.

Chemical group
Epoxy resin
Color
black
Specific Gravity
1.1
Viscosity (adhesives)
40000-60000

CHF 0.00 / ml
  • Brand
  • Manufacturer
  • Container
  • Country of origin
  • Chemical group
  • Color
  • Viscosity (adhesives)
  • Specific Gravity
  • Maximum gap fill (mm)
  • 135°C
  • 150°C
  • 160°C
  • Cure speed (induction)
  • Steel
  • Glass/ Polyester
  • Glass/ Epoxy
  • Carbon fiber
  • Tensile strength (ASTM D-2095-69)
  • Hardness (Shore D)
  • Impact strength (ASTM D-950)
  • Peel resistance (aluminum) (ISO 4578)
  • Storage Temperature (°C)
Your selection PERMABOND ES5681 49-5681.KT.ML320
General terms and conditions of business

Internal reference: 49-5681.KT.ML320
HS code: 35.069.190.000

PERMABOND ES5681 Sample Offer

Technical Data

Typical values, not a specification. The technical data sheet (TDS) is binding.

Product Information

Brand
Permabond
Manufacturer
Permabond Engineering Adhesives Ltd
Container
320 ml
Country of origin
Italy

Cure speed (oven)

135°C
35 minutes
150°C
20 minutes
160°C
15 minutes

Performance at Full Cure

Tensile strength (ASTM D-2095-69)
35-40 N/mm²
Impact strength (ASTM D-950)
30-40 kJ/m²
Peel resistance (aluminum) (ISO 4578)
180-200 N/25mm

Physical Properties

Chemical group
Epoxy resin
Color
black
Viscosity (adhesives)
40000-60000
Specific Gravity
1.1

Curing values

Maximum gap fill (mm)
0.5

Mechanical properties

Hardness (Shore D)
84

Shear strength ISO 4587 in N/mm²

Steel
30 - 35 N/mm²
Glass/ Polyester
3-5 N/mm²
Glass/ Epoxy
14-16 N/mm²
Carbon fiber
18-22 N/mm²

Thermal Properties

Storage Temperature (°C)
2-7

Features

Cure speed (induction)
< 2 minutes
Keywords
  • Metal
  • Ceramic
  • Composite Materials

Product Description

Permabond ES5681 is a special 1K epoxy with an engineering profile.

Engineering 1K epoxy with specific properties.

PRODUCT NOTE

Special 1K epoxy for engineering applications — technical data available via SILITECH distribution.

Permabond ES5681 in figures
1K
Single-part
Engineering
Special
Heat-cure
Heat curing
Consulting
SILITECH

What distinguishes Permabond ES5681

1K System
No mixing.
Engineering Special
Specific.
Heat-cure
Heat curing.
SILITECH consultation
Via sales.
Solvent-free
100% reactive.
Original Permabond
Manufacturer original.

What is Permabond ES5681 used for?

Engineering applications
Special requirements.
Industrial special solutions
With consultation.
R&D area
Test applications.
Custom bonding
Application-specific.
Industry Premium
With consultation.

Processing

1
Clean surfaces
Prepare bonding surfaces clean, dry, and free of grease — degrease with Permabond Cleaner A. Lightly sand aluminum and copper to remove the oxide layer.
2
Apply adhesive directly
Apply Permabond ES5681 directly from the container without mixing — as a 1K system, there is no pot life limitation. Avoid air bubbles.
3
Joining and fixing components
Join components with sufficient pressure. Use a clamping device or clamp to prevent the parts from moving during curing.
4
Perform heat curing
Curing occurs through heat application — heat curing. Typical conditions: 30 minutes at 150 °C in an industrial oven or with equivalent IR/hot air curing. See TDS for exact values.
5
Final strength after cooling
After heat curing, allow the component to cool down — full strength is achieved immediately after cooling. Unlike 2K epoxies at room temperature, there is no 24-hour waiting period.
Data Sheets & Safety Data Sheet
Complete TDS and SDS in DE, EN, FR — view or download directly.
To the documents →

Recommended accessories


Important Notes

Important Notes
Clarify with SILITECH sales before ordering.
Storage
Store at 5 to 25 °C. 1K heat-cure epoxies have limited storage stability — reactivity decreases with higher storage temperature. Observe the expiration date.

Which Permabond 1K epoxy for which application?

Permabond ES5681 in direct comparison with related products of the ES series.

Permabond ES5681
Current Product
Permabond ES568 →Permabond ES560 →Permabond ES578 →
ApplicationSpecial 1K epoxy (Engineering)ComparableComparableFlame-retardant
ChemistryOne-component epoxy resin1K epoxy1K epoxy1K epoxy
CuringHeat-cureHeat-cureHeat-cureHeat-cure

Frequently asked questions about Permabond ES5681

Practical application and design questions — answered by SILITECH.

Special 1K epoxy for engineering applications. 1K epoxies are processed directly without mixing and cured in a single heat-cure step.

1K epoxies are processed directly from the container without mixing — no pot life limitation, no mixing errors. Disadvantage: heat curing required (industrial oven, IR lamp, or hot air). 2K epoxies cure at room temperature but require precise mixing and have a limited pot life. 1K is suitable for line production with heat-cure infrastructure, 2K for workshops without an oven.

Heat curing. For exact conditions, refer to the Permabond TDS — typically 30 minutes at 150 °C or equivalent heat input (e.g., 60 min @ 120 °C).

1K heat-cure epoxies bond metals (steel, aluminum, copper), composites (CFK, GFK), ceramics, and selected plastics (with heat resistance). Substrates must tolerate the curing temperature (typically 150 °C).

Permabond ES5681 does not have specific industry approvals such as UL94-V0 (see ES578 for the flame-retardant variant). For general industrial applications, the product is approved according to Permabond standards.

At 5 to 25 °C. 1K heat-cure epoxies have limited storage stability — reactivity decreases with higher storage temperature. For long shelf life, store refrigerated. Allow adhesive to warm to room temperature before opening.

From the Permabond 1K epoxy range: Permabond ES5681 (Special 1K epoxy (Engineering)); Permabond ES568 (Engineering); Permabond ES560 (Engineering); Permabond ES578 (UL94-V0). For UL94-V0 fire protection, see ES578; for high temperature, see ES566/ES569; for IR/hot air curing (without an industrial oven), see ES5691.