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PERMABOND ES5681

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Special 1K epoxy (engineering) — on request

Special 1K epoxy ES5681 — Engineering applications with SILITECH consulting.

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  • brand
  • Manufacturer
  • Container
  • Country of origin
  • Chemical group
  • Color
  • Viscosity (adhesives)
  • Specific gravity
  • Maximum gap width (mm)
  • 135°C
  • 150°C
  • 160°C
  • Curing speed (induction)
  • Steel
  • Glass/Polyester
  • Glass/epoxy
  • carbon fiber
  • Tensile strength (ASTM D-2095-69)
  • Hardness (Shore D)
  • Impact resistance (astm D-950)
  • Peel resistance (aluminum) (ISO 4578)
  • Storage temperature (°C)

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Metal ceramic composites

 
General Terms and Conditions.

Shipping usually within 1 to 3 business days
(availability will be confirmed after ordering)

. Express logistics. Fast and reliable within Switzerland & Europe.

Shipping from Swiss warehouse within 24 hours. Batch certificate. Invoice within 30 days (B2B). Technical support.
Shipping & Delivery

Usually 1 to 3 working days

Availability will be confirmed after order receipt.

Express logistics within Switzerland & Europe.

General Terms and Conditions →

Product data

Internal reference: 49-5681.KT.G320

HS code: 35.069.190.000


Internal reference: 49-5681.KT.G320
HS code: 35.069.190.000

PERMABOND ES5681
PERMABOND ES5681
Permabond · Permabond Engineering Adhesives Ltd · SKU 49-5681.KT.G320

Permabond ES5681 is a special 1K epoxy with an engineering profile.

Engineering 1K epoxy with specific properties.

PRODUCT INFORMATION

Special 1K epoxy for engineering applications — technical data available via SILITECH distribution.

Permabond ES5681 in figures
1K
Single-part
Engineering
Special
Heat Cure
Heat curing
Advice
SILITECH

What distinguishes Permabond ES5681

1K system
Do not mix.
Engineering Specialist
Specific.
Heat Cure
Heat curing.
SILITECH Consulting
About sales.
Solvent-free
100% reactive.
Original Permabond
Manufacturer's original.

What is Permabond ES5681 used for?

Engineering applications
Special requirements.
Industrial special solutions
With consultation.
R&D area
Test applications.
Custom adhesives
Application-specific.
Industry Premium
With consultation.

processing

1
Clean surfaces
Prepare bonding surfaces to be clean, dry, and free of grease — degrease with Permabond Cleaner A. Lightly sand aluminum and copper to remove oxide layers.
2
Apply adhesive directly
Apply Permabond ES5681 directly from the container without mixing — as a 1K system, there is no pot life limitation. Avoid air bubbles.
3
Joining and fixing components
Assemble the components with sufficient pressure. Use a clamping device or vise to prevent the parts from moving during curing.
4
Perform heat curing
Curing is achieved through heat application — heat curing. Typical conditions: 30 minutes at 150 °C in an industrial oven or equivalent IR/hot air curing. See TDS for exact values.
5
Final strength after cooling
After heat curing, allow the component to cool down – final strength is reached immediately after cooling. Unlike with 2-component epoxies at room temperature, there is no 24-hour waiting time.
Data sheets & safety data sheet
Full TDS and SDS in DE, EN, FR — view or download directly.
To the documents →

Recommended accessories


Important instructions

Important instructions
Please clarify with SILITECH sales before ordering.
storage
Store between 5 and 25 °C. 1K heat-cure epoxides have limited storage stability—reactivity decreases with increasing storage temperature. Observe the expiration date.

Which Permabond 1K epoxy is suitable for which application?

Permabond ES5681 in direct comparison with related products of the ES series.

Permabond ES5681
Current product
Permabond ES568 →Permabond ES560 →Permabond ES578 →
ApplicationSpecial 1K epoxy (engineering)ComparableComparableFlame retardant
ChemistryOne-component epoxy resin1K epoxy1K epoxy1K epoxy
CuringHeat CureHeat CureHeat CureHeat Cure
Topics & Application Areas
Key terms related to this product. Also useful for our search and filters.
Metal ceramic composites

Technical data for PERMABOND ES5681

All 22 product information 4 Curing speed (oven) 3 Performance at final strength 3 Physical properties 4 Curing values ​​1 Mechanical properties 1 Shear strength ISO 4587 in N/mm² 4 Thermal properties 1 General 1
Product information
brand Permabond
Manufacturer Permabond Engineering Adhesives Ltd
Container 320 ml
Country of origin Italy
Curing speed (oven)
135°C 35 minutes
150°C 20 minutes
160°C 15 minutes
Performance at final strength
Tensile strength (ASTM D-2095-69) 35-40 N/mm²
Impact resistance (astm D-950) 30-40 kJ/m²
Peel resistance (aluminum) (ISO 4578) 180-200 N/25mm
Physical properties
Chemical group epoxy resin
Color black
Viscosity (adhesives) 40000-60000
Specific gravity 1.1
Curing values
Maximum gap width (mm) 0.5
Mechanical properties
Hardness (Shore D) 84
Shear strength ISO 4587 in N/mm²
Steel 30 - 35 N/mm²
Glass/Polyester 3-5 N/mm²
Glass/epoxy 14-16 N/mm²
carbon fiber 18-22 N/mm²
Thermal properties
Storage temperature (°C) 2-7
Generally
Curing speed (induction) < 2 minutes

For binding values, please refer to the technical data sheet (TDS) in the "Documents" tab.

Documents and datasheets

Click on a document for a preview or the download icon for a direct download.

Technical Data Sheets (TDS) 1
Permabond ES5681 - Technical Data Sheet EN.pdf
528 KB

Frequently asked questions about Permabond ES5681

Practical application and design questions — answered by SILITECH.

Special 1K epoxy for engineering applications. 1K epoxies are processed directly without mixing and cured in a single heat-cure step.

One-component (1K) epoxies are processed directly from the container without mixing—no pot life limitations, no mixing errors. Disadvantage: Heat curing is required (industrial oven, IR lamp, or hot air). Two-component (2K) epoxies cure at room temperature but require precise mixing and have a limited pot life. One-component (1K) epoxies are suitable for line production with heat-curing infrastructure, while two-component (2K) epoxies are suitable for workshops without an oven.

Heat curing. For exact conditions, see Permabond-TDS — typically 30 minutes at 150 °C or equivalent heat input (e.g. 60 min @ 120 °C).

One-component heat-cure epoxies bond metals (steel, aluminum, copper), composites (CFRP, GFRP), ceramics, and selected heat-resistant plastics. Substrates must tolerate the curing temperature (typically 150 °C).

Permabond ES5681 does not have specific industry approvals such as UL94-V0 (see ES578 for the flame-retardant variant). For general industrial applications, the product is approved according to Permabond standards.

Store between 5 and 25 °C. 1K heat-cure epoxies have limited storage stability—reactivity decreases with increasing storage temperature. For long shelf life, store refrigerated. Allow the adhesive to warm to room temperature before opening.

From the Permabond 1K epoxy range: Permabond ES5681 (Special 1K epoxy (Engineering)); Permabond ES568 (Engineering); Permabond ES560 (Engineering); Permabond ES578 (UL94-V0). For UL94-V0 fire protection, see ES578; for high temperature, see ES566/ES569; for IR/hot air curing (without an industrial oven), see ES5691.

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Product specifications

Product information
brand Permabond
Manufacturer Permabond Engineering Adhesives Ltd
Container 320 ml
Country of origin Italy
Curing speed (oven)
135°C 35 minutes
150°C 20 minutes
160°C 15 minutes
Performance at final strength
Tensile strength (ASTM D-2095-69) 35-40 N/mm²
Impact resistance (astm D-950) 30-40 kJ/m²
Peel resistance (aluminum) (ISO 4578) 180-200 N/25mm
Physical properties
Chemical group epoxy resin
Color black
Viscosity (adhesives) 40000-60000
Specific gravity 1.1
Curing values
Maximum gap width (mm) 0.5
Mechanical properties
Hardness (Shore D) 84
Shear strength ISO 4587 in N/mm²
Steel 30 - 35 N/mm²
Glass/Polyester 3-5 N/mm²
Glass/epoxy 14-16 N/mm²
carbon fiber 18-22 N/mm²
Thermal properties
Storage temperature (°C) 2-7
Uncategorized
Curing speed (induction) < 2 minutes
Keywords
Keywords
Metal ceramic composites

Documents and datasheets

Safety Data Sheets (SDS) and Technical Data Sheets (TDS) are available for download: